DS2409

MicroLANカプラ


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説明

The MicroLAN coupler is an essential component to build and control 1-Wire® networks with multi-level branching. In contrast to approaches that switch the ground line, the coupler maintains a common ground level for the whole network and keeps the inactive segments powered. This simplifies supplying central or local power for additional circuitry and prevents loss of status of parasitically powered devices. It also avoids disrupting communication caused by the parasitic power supply of 1-Wire devices after activating a branch. Both the main and the auxiliary 1-Wire output are supported by a smart-on command. This command generates a reset/presence sequence on the selected output before the electronic switch closes the contact to the 1-Wire bus. This way the bus master can apply a ROM function command (optionally followed by a memory function) to the devices on the just activated segment with all other devices in the network remaining deselected. This significantly speeds up the analysis of topology and population in a continuously changing network. The coupler also supports the bus master in detecting arrivals on the inactive segments of the network by responding to the conditional search command.

主な特長

  • Low impedance coupler to create large common-ground, multi-level 1-Wire networks
  • Keeps inactive branches pulled high to 5V
  • Simplifies network topology analysis by logically decoupling devices on active network segments
  • Conditional search for fast-event signaling
  • Auxiliary 1-Wire line to connect a memory chip or to be used as digital input
  • Programmable, general-purpose open-drain control output
  • Communicates at 16.3kbps
  • Unique, factory-lasered and tested 64-bit registration number assures absolute traceability because no two parts are alike
  • Built-in multidrop controller ensures compatibility with other 1-Wire products
  • Operating temperature range from -40°C to +85°C
  • Compact, low-cost 6-pin TSOC surface mount package

技術資料

アプリケーションノート 4930 Easy Modifications to Sustain a Design with the DS2409 MicroLAN™ Coupler
アプリケーションノート 2965 1-Wireマスターデバイスの構成
アプリケーションノート 155 1-Wireソフトウェアリソースガイドデバイス解説

品質および環境データ

製品の信頼性レポート: DS2409.pdf 
鉛フリーパッケージの錫(Sn)のウィスカレポート
デバイス   ウェハープロセス   プロセス技術   サンプルサイズ   不合格   FIT (25°C)   FIT (55°C)  

注: 不良率はプロセス技術ごとにまとめられ、関連する型番にマッピングされます。 不良率はテストされたユニット数に大きく依存します。

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関連リソース

種類 ID PDF タイトル
アプリケーションノート 4930 Easy Modifications to Sustain a Design with the DS2409 MicroLAN™ Coupler
アプリケーションノート 2965 1-Wireマスターデバイスの構成
アプリケーションノート 155 1-Wireソフトウェアリソースガイドデバイス解説