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Octal 3.0Gbps DCL with Integrated Level Setting DACs, Cable Droop Compensation, and PMU switches

Industry's Fastest Octal-Channel Pin Electronics Driver

製品の詳細

主な特長

簡易ブロック図

Technical Docs

サポートとトレーニング

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主な特長

  • Low Power at High-Speed Maximizes Driver Performance
    • Typical 0.89W Per Channel Power Dissipation
    • 10nA Low-Leak Mode
    • High-Speed Data Rate (50Ω)
      • 3.0Gbps Typical at 0.1Vpp
      • 2.5Gbps Typical at 0.5Vpp
      • 2.4Gbps Typical at 0.75Vpp
      • 1.3Gbps Typical at 1.5Vpp
    • Voltage Range from -1.5V to +4.5V
    • Integrated VHH Programming Mode (4th-Level Drive) up to 7.1V
  • Integrated Functionality Provides Value-Add Features
    • Integrated ±12mA Passive Load
    • Programmable Double Time Constant Cable Droop Compensation–Drive and Receive Paths
    • Digital Slew-Rate Control for EMI-Sensitive Applications
    • 64 Independent 14-bit Level-Setting DACs
    • 50MHz SPI Interface

アプリケーション/用途

  • SoC ATE
  • Memory ATE
  • Digital Testers
  • Burn-In Testers
  • Wafer Testers

説明

The MAX32007 is a fully integrated, high performance, high speed 3Gbps octal-channel pin electronics driver that integrates multiple automatic test equipment (ATE) functions into a single IC. This DCL (driver/comparator/load) device is compatible with most high-speed logic families and includes a 4-level driver, dynamic clamps, window comparator, passive load, differential comparator, slew rate control, driver and comparator cable droop compensation, voltage clamps, PMU switches, and level-setting DACs.

The MAX32007 driver features a -1.5V to +4.5V input range, high-impedance mode, active-termination (3rd-level drive), and VHH programming (4th-level drive) up to 7.1V. The window comparators provide low timing variation over changes in slew rate, pulse width, or overdrive voltage. The MAX32007 features dynamic clamps that limit high-speed device-under-test (DUT) waveforms as well as cable droop compensation for optimization of driver and return path signals. The integrated passive load is rated for ±12mA. Configuration of the many features are done through a 50MHz SPI interface.

The MAX32007 is available in a 16mm x 10mm x 1.4mm csBGA package with exposed pad on the top for easy heat removal. The ball pitch is 0.8mm with a ball grid array of 19x12. Typical power dissipation is rated for 0.89W per channel. The MAX32007 operates over an internal die temperature range of +40°C to +100°C with a nominal operating point of +70°C. The device provides both a temperature monitor output (TSA) and an over-temp indicator (TSD).

簡易ブロック図

Technical Docs

サポートとトレーニング

技術質問への回答についてはナレッジベースで検索ください。

絞り込まれた検索

マキシムでは、お客様の技術的質問にお答えするため、アプリケーションエンジニアの専任チームも配置しています。 サポートセンター をご利用ください。