Non-Lead-Free Information

Non-Lead-Free Soldering Remarks

Maxim meets JEDEC standard 020A which specifies that a 220 (+5/-0) degree Celsius maximum peak temperature profile should be used for packages measuring a thickness of < 2.5mm, and a volume of > 350mm³. JEDEC 020A also specifies a 235 (+5/-0) degree Celsius maximum peak temperature profile for packages measuring thickness of < 2.5mm, and a volume of < 350mm³. Approximately 90% of Maxim packages are subject to a 240°C maximum peak temperature profile.

JEDEC Solder Reflow Profile for Packages Containing Lead (PDF, 7kB).

Plating Thickness

Lead frames for all parts have a plating thickness of 300 to 800 microinches (µ-inch), or 7.5 to 20 microns.

Backward and Forward Compatibility

Backward and Forward Compatibility