ISO 14001 Environmental Management System

ISO 14001 implementation commenced at the Dallas Semiconductor facility in July 2003 and the site was registered on September 20, 2004. Other Maxim manufacturing sites have been registered since then. The Maxim headquarters facility in California was registered in January 2006.

• Maxim HQ San Jose ISO 14001:2004 Certificate (PDF)
• ISO 9001/TS 16949 Certifications

Environmental Policy

Maxim is committed to protecting the environment through excellence in environmental performance and continual improvements in our operations, products, and services.

It is Maxim's policy to:

• Prevent or reduce pollution to air, land, and water through programs that reduce environmental impacts and conserve natural resources
• Understand and commit to comply with legal and other requirements
• Review environmental objectives and targets and set guidelines for reduction of environmental impacts
• Evaluate the effectiveness of and continually improve our environmental management systems (EMS), and educate those working for or on behalf of the company where it is applicable to meet legal and other requirements

Environmental Commitment
Maxim is committed to continuous environmental improvement consisting of the following

• Reviewing and understanding current environmental legislation
• Implementing an effective EMS that addresses applicable customer and regulatory concerns
• Training employees
• Identifying the environmental impacts associated with company activities
• Setting targets and objectives to reduce or eliminate adverse impacts on the environment (e.g., source reduction and waste minimization practices)

Environmental Objective

Maxim's primary objective in regards to the environment is to implement an effective management system that will:

• Achieve compliance with legal and other requirements
• Result in a positive company image to citizens in surrounding communities
• Continuously reduce environmental impacts and conserve natural resources

Environmental Compliance

• All Maxim manufacturing sites operate within the requirements of local and state environmental authorities.
• Environmental operating requirements are generally outlined in regulatory discharge permits (e.g., air, wastewater, storm water, and waste).
• Maxim tracks environmental compliance and reports performance to relevant authorities.

Environmental Initiatives

• Maintain ISO 14001 registration
• RoHS compliance
• Improve supplier audit program for banned and restricted substances
• Centralized customer response center
• Web-based customer support

What is RoHS?

RoHS (Restriction of Hazardous Substances) is a European Union directive that restricts the use of lead, mercury, cadmium, chromium (VI), PBBs, and PBDEs in electrical and electronic equipment as of July 1, 2006. 

Lead is the only relevant RoHS substance for Maxim end products, and cadmium is the only relevant RoHS substance for Maxim packaging materials.

• RoHS Certificates and Statements

Lead-Free Initiative

• Maxim currently offers a variety of package types that meet "lead-free" criteria.
• Maxim is working to develop additional packages that meet "lead-free" criteria.
• Maxim business units control the development efforts for "lead-free" packages.

Material Composition of End Products

Standard Integrated Circuits and Modules

• Plastic packages consist of various components.
• Lead-frames, die-attach epoxies, bond wires, molding compounds, silicon chips, bumps, and surface finishes are the types of components present in plastic packages.
• Each component has its own substance composition.
• Typical substances present in Maxim plastic packages are copper, iron, zinc, magnesium, nickel, phosphorous, silver, epoxy, gold, antimony trioxide, bromine, silica dioxide, resin, silicon chips, tin, and lead (including 100% matte tin for lead-free surface finishes).
• The presence and concentrations of these substances vary from one package type to another.

Chip-Scale Packages (UCSP^™)

• UCSP packages consist of various components.
• Silicon chips, die coats, UBMs (under bump metals), and solder balls are the types of components present in UCSP packages.
• Each component has its own substance composition.
• Typical substances present in UCSP packages are silicon chips, resin, aluminum, nickel (V), copper, tin, and lead.

The presence and concentrations of these substances vary from one package type to another.