ISO 14001 Environmental Management System
ISO 14001 implementation commenced at the Dallas Semiconductor
facility in July 2003 and the site was registered on September 20,
2004. Other Maxim manufacturing sites have been registered since then.
The Maxim headquarters facility in California was registered in
Maxim is committed to protecting the environment through excellence
in environmental performance and continual improvements in our
operations, products, and services.
It is Maxim's policy to:
- Prevent or reduce pollution to air, land, and water through
programs that reduce environmental impacts and conserve natural
- Understand and commit to comply with legal and
- Review environmental objectives and
targets and set guidelines for reduction of environmental
- Evaluate the effectiveness of and continually improve
our environmental management systems (EMS), and educate those
working for or on behalf of the company where it is applicable to
meet legal and other requirements
Maxim is committed to
continuous environmental improvement consisting of the following
Maxim's primary objective in regards to the environment is to
implement an effective management system that will:
- Achieve compliance with legal and other requirements
- Result in a positive company image to citizens in surrounding
- Continuously reduce environmental impacts and
conserve natural resources
- All Maxim manufacturing sites operate within the requirements
of local and state environmental authorities.
operating requirements are generally outlined in regulatory
discharge permits (e.g., air, wastewater, storm water, and
- Maxim tracks environmental compliance and reports
performance to relevant authorities.
- Maintain ISO 14001 registration
- RoHS compliance
- Improve supplier audit program for banned and restricted
- Centralized customer response center
- Web-based customer support
What is RoHS?
RoHS (Restriction of Hazardous Substances) is a European Union
directive that restricts the use of lead, mercury, cadmium, chromium
(VI), PBBs, and PBDEs in electrical and electronic equipment as of
July 1, 2006.
Lead is the only relevant RoHS substance for Maxim end products, and
cadmium is the only relevant RoHS substance for Maxim packaging materials.
- Maxim currently offers a variety of package types that meet
- Maxim is working to develop
additional packages that meet "lead-free" criteria.
- Maxim business units control the development efforts for
Material Composition of End Products
Standard Integrated Circuits and Modules
- Plastic packages consist of various components.
- Lead-frames, die-attach epoxies, bond wires, molding compounds,
silicon chips, bumps, and surface finishes are the types of
components present in plastic packages.
- Each component has
its own substance composition.
- Typical substances present
in Maxim plastic packages are copper, iron, zinc, magnesium, nickel,
phosphorous, silver, epoxy, gold, antimony trioxide, bromine, silica
dioxide, resin, silicon chips, tin, and lead (including 100% matte
tin for lead-free surface finishes).
- The presence and
concentrations of these substances vary from one package type to
Chip-Scale Packages (UCSP™)
- UCSP packages consist of various components.
chips, die coats, UBMs (under bump metals), and solder balls are the
types of components present in UCSP packages.
component has its own substance composition.
substances present in UCSP packages are silicon chips, resin,
aluminum, nickel (V), copper, tin, and lead.
The presence and concentrations of these substances vary from one
package type to another.