Yes.
RoHS Substances:
Substances regulated by EU RoHS:
Lead, cadmium, hexavalent chromium, mercury, PBBs, and PBDEs
Possible RoHS substances in end products: Lead
Possible RoHS substances in packing materials: Cadmium
Components and Substances Contained in most leadframe based Plastic Packages:
Components: Leadframes, die attach, bond wire, molding compound, surface finish (plating), silicon chip.
Substances: Copper, iron, zinc, phosphorus, nickel, magnesium, gold, silver, tin, resin, lead (non Pb-free product), silicon and antimony trioxide and bromine (Sb2O3 and Br may be used as flame retardants in some molding compounds).
Components and Substances Contained in most µCSP/WLP packages:
Components: Silicon chips, die coats, UBMs (under bump metals) and solder bumps.
Substances: Silicon chips, resin, aluminum, nickel (V), copper, titanium, nickel, vanadium, tin, silver and lead (Pb is in non Pb-free products).
If the part is EU RoHS compliant then it is China RoHS compliant.