Evaluation Kit/Evaluation System for the MAX6695

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The MAX6695 evaluation kit (EV kit) is an assembled and tested PC board with a mounted MAX6695. The EV kit allows full evaluation of the MAX6695 temperature sensor. The MAX6695 monitors its own die temperature and the junction temperature of two external diode-connected transistors. It converts the temperature to 11-bit, 2-wire serial data that can be accessed over a 2-wire serial bus.

The MAX6695 EV kit includes both external diode-connected transistors (2N3906) soldered to the board, which can be removed. The board can then be connected through a twisted pair to remote diodes close to your system.

The MAX6695 evaluation system consists of a Maxim command module (CMOD232) and a MAX6695 EV kit. The CMOD232 board connects to a computer's RS-232 serial port to provide a computer-controlled SMBus™/I²C bus. Windows® 95/98/2000/XP-compatible software provides a user-friendly interface to exercise the features of the MAX6695. The program is menu driven and offers a graphic interface with control buttons and status display.

Order the MAX6695EVCMOD2 for a complete PC-based evaluation of the MAX6695. Order the MAX6695EVKIT if you already have an SMBus interface.

Key Features

  • Measure and Display Temperature of the MAX6695 and the Remote Diodes
  • Programmable Under/Over-Temperature Alarms
  • Programmable Conversion Rate
  • Programmable Over-Temperature Hysteresis
  • SMBus/I²C Compatible
  • Easy-to-Use Menu-Driven Software
  • Fully Assembled and Tested
  • Include Windows 95/98/2000/XP-Compatible Software and Demo PC Board


  • Desktop Computers
  • Notebook Computers
  • Servers
  • Test and Measurement Equipment
  • Workstations
Request Reliability Report for: MAX6695EVCMOD2 
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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