Evaluation System/Evaluation Kit for the MAX6660

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The MAX6660 evaluation system (EV system) consists of a MAX6660 evaluation kit (EV kit) and a companion Maxim System Management Bus (SMBus™) interface board.

The MAX6660 EV kit is an assembled and tested PC board that demonstrates the MAX6660 remote temperature sensor and fan-speed regulator. It monitors the junction temperature of an external diode-connected transistor, and converts the temperature to 8-bit or 11-bit (extended resolution mode), 2-wire serial data. A 2N3906 temperature-sensor transistor comes soldered to the board in a SOT23 package, but it can be removed. The board can then be connected through a twisted pair to a remote diode close to your system. The MAX6660 also incorporates a closed-loop fan controller that regulates fan speed with tachometer feedback. Note: Use this EV kit data sheet in conjunction with the MAX6660 data sheet.

The Maxim SMBus interface board (MAXSMBus) allows an IBM®-compatible PC to use its parallel port to emulate an SMBus 2-wire interface. Windows® 95/98/2000-compatible software provides a user-friendly interface to exercise the features of the MAX6660. The program is menu driven and offers a graphic interface with control buttons and status display. (Note: Windows 2000 requires the installation of a driver; refer to Win2000.pdf or Win2000.txt located on the diskette.)

Order the MAX6660EVSYS for a complete IBM PC-based evaluation of the MAX6660. Order the MAX6660EVKIT if you already have an SMBus interface.

Key Features

  • Measures and Displays Remote-Sensor Temperature
  • Controls Fan Speed
  • Programmable Alarms and Configuration
  • Operating Temperature Ranges
    • -40°C to +125°C (Remote Sensor)
    • 0°C to +70°C (Board)
  • I²C/SMBus Compatible
  • Easy-to-use Menu-Driven Software
  • Assembled and Tested
  • Includes Windows 95/98/2000-Compatible Software and Demo PC Board


  • Industrial Control Systems
  • Notebook Computers
  • PC
  • Servers
  • Telecom Systems
  • Workstations

Additional Resources

Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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