Evaluation System for the MAX1454

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The MAX1454 evaluation system (EV system) includes one MAX1454 master board and one MAX1454 evaluation kit (EV board). The MAX1454 daughter board system (DB system) includes one MAX1454 daughter board and one MAX1454 EV board. The EV system, when combined with the DB system, provides a proven design to evaluate up to 15 MAX1454 precision sensor signal conditioners. The EV system also includes Windows XP®-, Windows Vista®-, and Windows® 7-compatible software that provides a simple graphical user interface (GUI) for exercising the features of the IC. The master board includes interface circuitry to communicate between the IC and the host computer, circuitry to address each of the 15 devices in a fully loaded system, and circuitry to connect to the EV board in position 1. The EV board comes installed with a MAX1454AUE/V+ in a 16-pin TSSOP package. The daughter board includes circuitry and relays to connect to the EV board. Each position in the system, with the exception of position 1, requires a daughter board and an EV board. Therefore, to evaluate 15 MAX1454 devices, one EV system and 14 DB systems are required. Figure 1 in the full data sheet shows a partially expanded system, for four positions.
MAX1454EVSYS: Evaluation System Board MAX1454EVSYS: Evaluation System Board Enlarge+

Key Features

  • USB Powered
  • Evaluates Up to 15 MAX1454 Devices
  • Daughter Board and EV Board Powered by the Master Board
  • Sensor Socket on the EV Board
  • On-Board ADC to Read the OUT Voltage of the MAX1454
  • Windows XP-, Windows Vista-, and Windows 7-Compatible Software
  • User-Friendly Graphical User Interface (GUI)
  • Proven PCB Layout
  • Fully Assembled and Tested


  • Pressure Calibrators and Controllers
  • Pressure Sensors
  • Resistive Element Sensors
  • Strain Gauges
  • Humidity Sensors
Request Reliability Report for: MAX1454EVSYS 
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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