MAX77504

14V Input, 3A High-Efficiency Buck Converter in WLP or QFN

High-Efficiency Buck Converter in Small 1.7mm x 1.7mm WLP


Please check latest availability status for a specific part variant.

Description

The MAX77504 is a synchronous 3A step-down DC-DC converter optimized for portable 2-cell and 3-cell battery-operated applications. The converter operates on an input supply between 2.6V and 14V. Output voltage is adjustable between 0.6V and 6V with external feedback resistors. The device features a low-IQ SKIP mode that allows excellent efficiency at light loads. The MAX77504 can be sychronized by driving the FPWM pin with an external clock.

Dedicated enable, power-OK, and FPWM pins allow simple hardware control. The SEL input easily configures switching frequency, gain, and output active discharge option. Built-in undervoltage lockout (UVLO), output active discharge, cycle-by-cycle inductor current limit, thermal shutdown, and short-circuit protection ensure safe operation under abnormal operating conditions.

The MAX77504 is offered in a small 1.7mm x 1.7mm, 16-bump, 0.4mm pitch wafer-level package (WLP) or a 2.5mm x 2.5mm, 12-lead, 0.5mm pitch flip-chip QFN (FC2QFN).

Key Features

  • 3A Single-Channel Buck Regulator
  • 2.6V to 14V Input Voltage
  • 0.6V to 6V Output Voltage Range
  • 0.5MHz to 1.5MHz Fixed-Frequency Switching Options 
  • High Efficiency, Low IQ Extends Battery Life
    • 94% Peak Efficiency at 7.4VIN, 3.3VOUT (2520 Inductor)
    • 10μA ISUP (12VIN, 1.8VOUT)
    • OUT Powers VL Automatically (VOUT > 1.7V) for Low IQ
  • Enable Pin (EN) for Direct Hardware Control
  • Extenal Clock Synchronization Is Available Through the FPWM/SYNC Pin
  • Power-OK Output (POK) Monitors VOUT Quality (See Ordering Information)
  • Protection Features
    • Cycle-by-Cycle Inductor Current Limit
    • Short-Circuit Hiccup Mode, UVLO, and Thermal Shutdown Protection
    • Soft-Start 
  • FC2QFN or WLP Package Option
    • 2.5mm x 2.5mm (0.6mm max. height) 12-Lead FC2QFN, 0.5mm Pitch
    • 1.7mm x 1.7mm (0.7mm max. height) 16-Bump WLP, 0.4mm Pitch, 4 x 4 Array
  • All WLP Package Bumps (Except POK) Routeable on a Non-HDI PCB

Applications/Uses

  • 1- to 3-Cell Li+/Li-ion Battery-Powered Devices
  • Professional Radio, Handheld Computers
  • Mirrorless Cameras, DSLR, and Notebook Computers
  • Portable Scanners, POS Terminals, Printers
  • Space-Constrained Portable Electronics

MAX77504WEVKIT: Evaluation Kit for the MAX77504

Quality and Environmental Data

Request Reliability Report for: MAX77504 
Lead-Free Package Tin (Sn) Whisker Reports

Tools & Models

  • EE-Sim: Design & Simulate MAX77504
  • Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

    Quality Management System >
    Environmental Management System >

     
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