MAX5953D

IEEE 802.3af PD Interface and PWM Controllers with Integrated Power MOSFETs


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Description

The MAX5953A/MAX5953B/MAX5953C/MAX5953D integrate a complete power IC solution for Powered Devices (PD) in a Power-Over-Ethernet (PoE) system, in compliance with the IEEE 802.3af standard. The MAX5953A/MAX5953B/MAX5953C/MAX5953D provide the PD with a detection signature, a classification signature, and an integrated isolation switch with programmable inrush current control. These devices also integrate a voltage-mode PWM controller with two power MOSFETs connected in a two-switch voltage-clamped DC-DC converter configuration.

An integrated MOSFET provides PD isolation during detection and classification. All devices guarantee a leakage current offset of less than 10µA during the detection phase. A programmable current limit prevents high inrush current during power-on. The devices feature power-mode undervoltage lockout (UVLO) with wide hysteresis and long deglitch time to compensate for twisted-pair-cable resistive drop and to assure glitch-free transition between detection, classification, and power-on/-off phases. The MAX5953A/MAX5953C have an adjustable UVLO threshold with the default value compliant to the 802.3af standard, while the MAX5953B/MAX5953D have a lower and fixed UVLO threshold compatible with some legacy pre-802.3af power-sourcing equipment (PSE) devices.

The DC-DC converters are operable in either forward or flyback configurations with a wide input voltage range from 11V to 76V and up to 15W of output power. The voltage-clamped power topology enables full recovery of stored magnetizing and leakage inductive energy for enhanced efficiency and reliability. When using the high-side MOSFET, the controller can be configured as a buck converter. A look-ahead signal for driving secondary-side synchronous rectifiers can be used to increase efficiency. A wide array of protection features include UVLO, over-temperature shutdown, and short-circuit protection with hiccup current limit for enhanced performance and reliability. Operation up to 500kHz allows for smaller external magnetics and capacitors.

The MAX5953A/MAX5953B/MAX5953C/MAX5953D are available in a high-power (2.22W), 7mm x 7mm thermally enhanced thin QFN package.
MAX5953A, MAX5953B, MAX5953C, MAX5953D: Typical Operating Circuit MAX5953A, MAX5953B, MAX5953C, MAX5953D: Typical Operating Circuit Enlarge+

Key Features

  • Powered Device Interface
    • Fully Integrated IEEE 802.3af-Compliant PD Interface
    • PD Detection and Programmable Classification Signatures
    • Less than 10µA Leakage Current Offset During Detection
    • Integrated MOSFET for Isolation and Inrush Current Limiting
    • Gate Output Allows External Control of the Internal Isolation MOSFET
    • Programmable Inrush Current Control
    • Programmable Undervoltage Lockout (MAX5953A/MAX5953C)
  • DC-DC Converter
    • Clamped, Two-Switch Power IC for High Efficiency
    • Integrated High-Voltage 0.4Ω Power MOSFETs Up to 15W Output Power
    • Bias Voltage Regulator with Automatic High-Voltage Supply Turn-Off
    • 11V to 76V Wide Input Voltage Range
    • Feed-Forward Voltage-Mode Control for Fast Input Transient Rejection
    • Programmable Undervoltage Lockout
    • Overtemperature Shutdown
    • Indefinite Short-Circuit Protection with Programmable Fault Integration
    • Integrated Look-Ahead Signal for Secondary-Side Synchronous Rectification
    • > 90% Efficiency with Synchronous Rectification
    • Up to 500kHz Switching Frequency
  • High-Power (2.22W), 7mm x 7mm Thermally Enhanced Lead-Free Thin QFN Package

Applications/Uses

  • Computer Telephony
  • IEEE 802.3af Powered Devices
  • Internet Appliances
  • IP Phones
  • Security Cameras
  • Wireless Access Nodes

Technical Documents

Reference Schematic 3912 Low-Cost, Complete Power Solution for Powered Devices Includes a 12V Buck Converter

Quality and Environmental Data

Request Reliability Report for: MAX5953D 
Lead-Free Package Tin (Sn) Whisker Reports

CAD Symbols and Footprints

  • MAX5953DUTM+T
  • Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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