Multiphase Master with PMBus Interface and Internal Buck Converter

 

Part Number	Replacement	Explanation

Description

Create a design and simulate using EE-Sim^® tools:

The MAX20751 PMBus^™-compliant multiphase master IC, with extensive status and parameter monitoring, is capable of driving up to four smart-slave integrated power devices.

Utilizing Maxim’s smart-slave ICs, the device provides a high-density and flexible solution that can be tailored to a range of power loads used in communication equipment. Proprietary-coupled inductors, recommended to reduce the effective inductor value without excessive ripple current, results in improved transient response and reduction in the number of output capacitors required.

The device incorporates current reporting, temperature monitoring, fault detection, and PMBus support. Overcurrent and overtemperature faults are detected by the individual smart slaves and faults communicated through the master IC. The highest junction temperature is reported, both before and after smart-slave regulation.

The device features an integrated switching regulator that can optionally be used to supply the V_DD rail for the master controller and smart-slave devices to reduce the power-rail requirements and simplify the regulator design.

MAX20751: Typical Operating Circuit Enlarge+

Key Features

• Increased Power Density with Fewer External Components Needed
  • Scalable, Multiphase Solution
  • Compatibility with Coupled Inductors Enables Fast Transient Response and Reduced C_OUT
  • Integrated Internal Switching Regulator to Power Smart Slaves
• Optimized Component Performance and Efficiency with Reduced Design-In Time
  • PMBus-Compliant Interface for Telemetry and Power Management
  • Field-Programmable Memory to Allow Storage of Desired Configuration Parameters
  • Fault Logging
• Comprehensive System and IC Self-Protection Features Promote Increased Power-Supply Reliability
  • Overcurrent and Overtemperature
  • Boost Voltage UVLO
  • VX Short to Ground or V_DDH Detection
  • Phase-Current Steering for Thermal Balancing
• 36-Pin (6mm × 6mm) QFN Package

Applications/Uses

• Communication, Networking, Servers, and Storage Equipment: ASICs, Memory V_DDQ, Microprocessor Chipsets, and other High-Current Digital ICs