MAX20751

Multiphase Master with PMBus Interface and Internal Buck Converter


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Description

The MAX20751 PMBus-compliant multiphase master IC, with extensive status and parameter monitoring, is capable of driving up to four smart-slave integrated power devices.

Utilizing Maxim’s smart-slave ICs, the device provides a high-density and flexible solution that can be tailored to a range of power loads used in communication equipment. Proprietary-coupled inductors, recommended to reduce the effective inductor value without excessive ripple current, results in improved transient response and reduction in the number of output capacitors required.

The device incorporates current reporting, temperature monitoring, fault detection, and PMBus support. Overcurrent and overtemperature faults are detected by the individual smart slaves and faults communicated through the master IC. The highest junction temperature is reported, both before and after smart-slave regulation.

The device features an integrated switching regulator that can optionally be used to supply the VDD rail for the master controller and smart-slave devices to reduce the power-rail requirements and simplify the regulator design.
MAX20751: Typical Operating Circuit MAX20751: Typical Operating Circuit Enlarge+

Key Features

  • Increased Power Density with Fewer External Components Needed
    • Scalable, Multiphase Solution
    • Compatibility with Coupled Inductors Enables Fast Transient Response and Reduced COUT
    • Integrated Internal Switching Regulator to Power Smart Slaves
  • Optimized Component Performance and Efficiency with Reduced Design-In Time
    • PMBus-Compliant Interface for Telemetry and Power Management
    • Field-Programmable Memory to Allow Storage of Desired Configuration Parameters
    • Fault Logging
  • Comprehensive System and IC Self-Protection Features Promote Increased Power-Supply Reliability
    • Overcurrent and Overtemperature
    • Boost Voltage UVLO
    • VX Short to Ground or VDDH Detection
    • Phase-Current Steering for Thermal Balancing
  • 36-Pin (6mm × 6mm) QFN Package

Applications/Uses

  • Communication, Networking, Servers, and Storage Equipment: ASICs, Memory VDDQ, Microprocessor Chipsets, and other High-Current Digital ICs

Pricing Notes:
This pricing is BUDGETARY, for comparing similar parts. Prices are in U.S. dollars and subject to change. Quantity pricing may vary substantially and international prices may differ due to local duties, taxes, fees, and exchange rates. For volume-specific and version-specific prices and delivery, please see the price and availability page or contact an authorized distributor.

MAX20751S1VKIT: Evaluation Kit for the MAX20751/VT1697SB

Tools & Models

  • EE-Sim: Design & Simulate MAX20751
  • Product Reliability Reports: MAX20751.pdf 
    Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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