MAX1763EVKIT

MAX1763 Evaluation Kit


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Description

The MAX1763 evaluation kit (EV kit) is a fully assembled and tested surface-mount printed-circuit board (PCB) that contains two separate boost switching-regulator circuits. The first circuit (left side) utilizes a MAX1763 in a 16-pin QSOP package and is configured for a +3.3V output that accepts inputs from a +0.7V to VOUT source and provides up to 1.1A of current. A 1- or 2-cell alkaline battery source can also power the input.

The second circuit (right side) uses a MAX1763 in a high-power 16-pin TSSOP-EP (exposed pad) package, is configured for a +3.3V output, and supplies up to 1.4A of current. It accepts inputs from a +0.7V to +5.5V source, or a 1- or 2-cell alkaline battery can power the input. The right side includes a low-dropout (LDO) linear regulator that draws power from the +3.3V output and provides +2.8V at up to 1A of current.

The MAX1763 features an internal N-channel MOSFET switch, a P-channel MOSFET synchronous rectifier, and pulse-width modulation (PWM) operation for maximum efficiency. The MAX1763 EV kit demonstrates low quiescent current and high efficiency up to 96% for maximum battery life. Operation at 1MHz allows the use of tiny surface-mount components.

Key Features

  • +0.7V to +5.5V Input Range
  • Output Voltages
    • +3.3V Fixed Output at 1.1A (left side)
    • +3.3V Fixed Output at 1.4A (right side)
    • +2.8V LDO Linear Regulator Output at 1A (right side) as Shipped
  • Internal N-Channel Power Switch and P-Channel Synchronous Rectifier
  • 1µA Shutdown Current
  • 1MHz Switching Frequency
  • Externally Synchronizable (500kHz to 1.2MHz)
  • Surface-Mount Components
  • Fully Assembled and Tested

Applications/Uses

  • Cable Modems
  • Cell Phones
  • Consumer Audio
  • Cordless Phones
  • Digital Still Cameras
  • Global Positioning Systems (GPS)
  • Pagers
  • Pen Entry Palmtops
  • POS Terminals
  • Wireless Data
  • Wireless Local Area Networks (WLANs)
  • Wireless Local Loop (WLL)

Quality and Environmental Data

Lead-Free Package Tin (Sn) Whisker Reports
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

Quality Management System >
Environmental Management System >

 
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