DS1232

MicroMonitor Chip


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Description

The DS1232 MicroMonitor™ Chip monitors three vital conditions for a microprocessor: power supply, software execution, and external override. First, a precision temperature-compensated reference and comparator circuit monitors the status of VCC. When an out-of-tolerance condition occurs, an internal power fail signal is generated which forces reset to the active state. When VCC returns to an in-tolerance condition, the reset signals are kept in the active state for a minimum of 250ms to allow the power supply and processor to stabilize.

DS1232: Block Diagram DS1232: Block Diagram Enlarge+

Key Features

  • Halts and restarts an out-of-control microprocessor
  • Holds microprocessor in check during power transients
  • Automatically restarts microprocessor after power failure
  • Monitors pushbutton for external override
  • Accurate 5% or 10% microprocessor power supply monitoring
  • Eliminates the need for discrete components
  • Space-saving, 8-pin mini-DIP
  • Optional 16-pin SOIC surface mount package
  • Industrial temperature -40°C to +85°C available, designated N

See parametric specs for Supervisors (1 Monitored Voltage) (250)


Part NumberReset Thresh.
(V)
Reset OuttRESETWatchdog FeatureWatchdog TimeoutSupervisor FeaturesReset Thresh. Accur.
(%)
ICC
(µA)
Package/PinsBudgetary
Price
(min)(@ +25°C)(max)(See Notes)
DS1232 3.3 to 5.5
Active High
Active Low
Open Drain
Push-Pull
85ms to 300msInput (WDI)
1s to 2s
<1s
Manual Reset2.52000
PDIP/8
SOIC (W)/16
$1.86 @1k

Pricing Notes:
This pricing is BUDGETARY, for comparing similar parts. Prices are in U.S. dollars and subject to change. Quantity pricing may vary substantially and international prices may differ due to local duties, taxes, fees, and exchange rates. For volume-specific and version-specific prices and delivery, please see the price and availability page or contact an authorized distributor.
Product Reliability Reports: DS1232.pdf 
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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