Description

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The MAX77654 provides highly-integrated battery charging and power supply solutions for low-power applications where size and efficiency are critical. The IC features a SIMO buck-boost regulator that provides three independently programmable power rails from a single inductor to minimize total solution size.  Two 100mA LDOs provide ripple rejection for audio and other noise-sensitive applications. The LDOs can also be configured as load switches to manage power consumption by disconnecting external blocks when not required. A highly-configurable linear charger supports a wide range of Li+ battery capacities and includes battery temperature monitoring for additional safety (JEITA).

This device includes three GPIOs and an analog multiplexer that switches several internal voltage and current signals to an external node for monitoring with an external ADC. A bidirectional I²C serial interface allows for configuring and checking the status of the devices. An internal on/off controller provides a controlled startup sequence for the regulators and provides supervisory functionality while they are on. Numerous factory programmable options allow the device to be tailored for many applications, enabling faster time to market.

Key Features

• Highly Integrated
  • 3x Output, Single-Inductor Multiple-Output (SIMO) Buck-Boost Regulator
    • Supports Wide Output Voltage Range from 0.8V to 5.5V for all SIMO Channels
  • 2x 100mA LDO/LSW
  • Smart Power Selector™ Li+/Li-Poly Charger
  • 3x GPIO Resources
  • Analog MUX Output for Power Monitoring
  • Factory Ship Mode (< 200nA I_Q)
  • Watchdog Timer
• Low Power
  • 0.3μA Shutdown Current
  • 6μA Operating Current (3 SIMO Channels + 2 LDOs)
• Charger Optimized for Small Battery Size
  • Programmable Fast-Charge Current from 7.5mA to 300mA
  • Programmable Battery Regulation Voltage from 3.6V to 4.6V
  • Programmable Termination Current from 0.375mA to 45mA
  • JEITA Battery Temperature Monitors Adjust Charge Current and Battery Regulation Voltage for Safe Charging
• Flexible and Configurable
  • I²C-Compatible Interface and GPIO
  • Factory OTP Options Available
• Small Size
  • 6.52mm² Wafer-Level Package (WLP)
  • 30-Bump, 0.4mm Pitch, 6x5 Array

Applications/Uses

• Bluetooth Headphones, Hearables
• Wireless Speakers
• Fitness, Health, and Activity Monitors
• Wearables
• Safety and Security Monitors
• Sensor Nodes
• Portable Consumer Devices
• Internet of Things (IoT)