MAX17039EVKIT

Evaluation Kit for the MAX17000, MAX17007A, and MAX17039


Please check latest availability status for a specific part variant.

Description

The MAX17039 evaluation kit (EV kit) demonstrates the high-power, dynamically adjustable, multiphase IMVP-7 notebook application circuit. This DC-DC converter steps down high-voltage batteries and/or AC adapters, generating two precision, low-voltage CPU/GPU core rails. The EV kit meets the Intel mobile IMVP-7 CPU's transient voltage specification, power-good signaling, voltage regulator thermal monitoring (active-low VR_HOT), power-good outputs (VR__READY), and serial VID communication and control specification. The MAX17039 consists of two high-current SMPSs for the CPU and GPU cores. The CPU regulator is a 3-phase interleaved Quick-PWM™ architecture with one MAX8791 single-synchronous MOSFET driver. The second GPU regulator is also a 1-phase Quick-PWM architecture. The 3-phase CPU core SMPS runs 120° out-of-phase for true interleaved operation, minimizing input capacitance.

Both CPU/GPU output voltages are controlled independently and are dynamically changed through a 3-wire serial VID interface (3-wire SVID: VCLK, VDIO, active-low ALERT), allowing the switching regulators to be individually programmed to different voltages. The EV kit includes active voltage positioning with adjustable gain, reducing power dissipation and bulk output capacitance requirements. A slew-rate controller allows controlled transitions among VID codes, controlled soft-start, and shutdown. SVID also allows each regulator to be individually set into a low-power, pulse-skipping state.

The MAX17039 provides a digitally adjustable 0 to 1.5200V output-voltage range from a 7V to 20V battery-input range. Each phase of the CPU core SMPS is designed for a 20A thermal-design current and delivers up to 33A peak output current for a total of 99A. The 1-phase GPU core SMPS is designed for 20A thermal-design current and delivers up to 33A peak output current. The CPU core SMPS operates at 350kHz switching frequency (per phase) and has superior line- and load-transient response. The GPU core SMPS operates at 440kHz switching frequency relative CPU core SMPS.

The MAX17039 EV kit also evaluates the MAX17000 and MAX17007A DC-DC converters. The EV kit also includes Windows® 2000-, Windows XP®-, and Windows Vista®-compatible software that provides a simple graphical user interface (GUI) for exercising the features of the MAX17039.

Key Features

  • MAX17039:
    • Intel IMVP-7 Serial VID-Compliant 25MHz Interface
    • 0 to 1.5200V Output-Voltage Range
    • 7V to 20V Input-Voltage Range
    • Core CPU SMPS
      • 3-Phase, Fast-Response Interleaved, Quick-PWM
      • Two Internal Drivers + One External Driver (MAX8791)
      • Transient-Suppression Feature
      • 99A Peak Load-Current Capability (33A Each Phase)
      • 350kHz Switching Frequency (per Phase)
    • Core GPU SMPS
      • 1-Phase, Fast-Response Internal Driver Quick-PWM
      • 33A Peak Load-Current Capability
      • 440kHz Switching Frequency
    • Active Voltage Positioning with Adjustable Gain
    • Power-Good (VR__READY) Outputs
    • External Thermal-Fault Detection (Active-Low VR_HOT)
    • Output Current Monitors (IMON_)
    • Overvoltage-, Undervoltage-, and Thermal-Fault Protections
    • 56-Pin Thin QFN Package
  • MAX17000:
    • Complete DDR Supplies: VCCDDR, VTTDDR, VTTR
    • 7V to 20V Input-Voltage Range
    • 400kHz Switching Frequency
    • 10A Output Current Capability (VCCDDR)
    • 2A Output Current Capability (VTTDDR)
    • 3mA Output Current Capability (VTTR)
    • Overvoltage Protection
    • Power-Good Output Indicators (D15 and D16)
    • 24-Pin Thin QFN Package
  • MAX17007A:
    • I/O Supplies: VTT1 and VTT2
    • 7V to 20V Input-Voltage Range
    • 300kHz Switching Frequency
    • 6A Output Current Capability (VTT1)
    • 21A Output Current Capability (VTT2)
    • Overvoltage-, Undervoltage-, and Thermal-Fault Protections
    • Power-Good Output Indicators (D19 and D20)
    • 28-Pin Thin QFN Package

Applications/Uses

  • Notebooks/Desktops/Servers
  • Voltage-Positioned Step-Down Converters
  • VR12/IMVP-7 CPU Core Power Supplies

Quality and Environmental Data

Lead-Free Package Tin (Sn) Whisker Reports
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

Quality Management System >
Environmental Management System >

 
Status:
Package:
Temperature:

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