Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator

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The MAXQ3210 microcontroller is a low-power, 16-bit RISC device that incorporates a driver for a high-output piezoelectric horn/transducer, an analog comparator, and a high-current I/O pin that directly drives an LED. The device is uniquely suited for cost-conscious applications such as chemical detectors, alarm systems, and white goods, but can be used in any application that requires high-performance and low-power operation. The high-performance 16-bit RISC core and 8-bit accumulators are complemented by standard amenities such as timers and digital I/O. The power consumption per MIPS ratio is among the best in the 16-bit microcontroller industry.

The MAXQ3210 is powered directly from a 6V to 9.5V source, such as a battery, but an internal voltage regulator operates the core at 5V. The microcontroller also provides a flag if the input voltage supply falls below the low-batttery detection threshold (VBF), which can be used to signal a low-voltage condition of the 9V battery. The MAXQ3212 is a general-purpose version of the MAXQ3210 that is powered directly from an external 5.0V supply.

A 1kWord EEPROM program memory stores customer application code and software algorithms. Software is programmable in-system by the ROM-based bootloader and also in-application programmable under user software control. The device provides 64 bytes of volatile SRAM and 128 bytes of EEPROM in the data memory space. Contact Dallas Semiconductor concerning the availability of ROM-based devices for high-volume, low-cost applications.

Note: Designers must have the following documents to fully use all the features of this device. This data sheet contains pin descriptions, feature overviews, and electrical specifications. Errata sheets contain deviations from published specifications. The user's guides offer detailed information about device features and operation.
MAXQ3210: Typical Operating Circuit MAXQ3210: Typical Operating Circuit Enlarge+

Key Features

  • High-Performance, Low-Power, 16-Bit RISC Core
    • DC to 3.58MHz Operation, Approaching 1MIPS per MHz
    • Low-Cost Operation from "Colorburst" Crystal or RC Oscillator
    • 6V to 9.5V External Voltage Supply Operates from Single 9V Battery
    • 5.0V Nominal Internal Operation
    • Up to 15 General-Purpose I/O Pins
    • 33 Instructions, Most Single-Cycle
    • Three Independent Data Pointers Accelerate Data Movement with Automatic Increment/Decrement
    • Two Loop Counters
    • 4-Level Hardware Stack
    • 16-Bit Instruction Word, 16-Bit Data Bus
    • 16 x 8-Bit Accumulators
    • JTAG Debug/Visibility Port
  • Program and Data Memory
    • 1kWord EEPROM Program Memory, Mask ROM for High-Volume Applications
    • 128 Bytes EEPROM Data Memory
    • 60,000 EEPROM Write/Erase Cycles
    • 64 Bytes SRAM Data Memory
    • In-System Programming
  • Peripheral Features
    • Piezoelectric Horn Driver
    • 16-Bit Programmable Timer/Counter with Prescaler
    • High-Current I/O Pin Suitable for LED Drive
    • Programmable Watchdog Timer
    • Selectable Power-Fail Reset
    • Power-On Reset (POR)
    • Wake-Up Timer
    • Internal 8kHz Ring Oscillator
  • Flexible Programming Interface
    • Integrated Bootloader
    • In-System/In-Application Programming of EEPROM Through JTAG
  • Ultra-Low-Power Consumption
    • < 6mA at 3.58MHz
    • 5.5µA Standby Current (typ)
    • Low-Power Divide-by-256 Mode
  • Analog Features
    • Analog Comparator Uses Internal or External Voltage Reference
    • +2.5V Reference Output Available
    • On-Chip Voltage Regulator Supports Up to 9.5V as Power Supply
    • Low-Battery Detection
    • 5V Regulated Output Available, Up to 50mA


  • Battery-Powered and Portable Devices
  • Electrochemical and Optical Sensors
  • Environmental Systems
  • Gas and Chemical Sensors
  • Home Appliances
  • Security Alarm Systems
  • Thermostats/Humidity Sensors
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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