Evaluation Kit for the MAXQ1850 and MAXQ1851

Please check latest availability status for a specific part variant.


The MAXQ1851 evaluation kit (EV kit) is a proven platform to conveniently evaluate the capabilities of the MAXQ1850 or the MAXQ1851 secure microcontrollers. The EV kit board features a socket for the target microcontroller, two smart card sockets, a PIN pad, and all the communication connectors needed to develop a financial terminal design. With the included software and a MAXQ® USB-to-JTAG/1-Wire adapter board, the EV kit also provides a complete, functional system ideal for software development and debugging of applications targeted for the MAXQ1850 or MAXQ1851. The MAXQ1850 and MAXQ1851 microcontrollers have similar features and are pin compatible. The MAXQ1851 has larger RAM memory size and secure nonvolatile AES key generation and storage.

Key Features

  • Easily Load and Debug Code with the Supplied MAXQ USB-to-JTAG/1-Wire Adapter Board
  • JTAG Interface Provides In-Application Debugging Features
    • Step-by-Step Execution Tracing
    • Breakpointing by Code Address
    • Data Memory or Register Content View and Edit
    • Includes Two-Line by 20-Character LCD Module
    • Single 5V Power-Supply Input and On-Board 3.3V Voltage Regulators
  • 4 x 4 Keypad Matrix
  • Self-Destruct Inputs Available on Headers for Connecting to External Trigger Circuits
  • Battery for Memory Backup and Real-Time Clock Operation
  • Level-Shifted RS-232 Interface Included for Serial Port
  • Test/Expansion Headers
  • Two Smart Card Sockets (One Full-Size Socket and One SIM Socket)
  • Mini-USB, Type-B Connector
  • Board Schematics Provide a Convenient Reference Design
  • Proven PCB Layout
  • Fully Assembled and Tested


  • ATM Keyboards
  • Certificate Authentication
  • Electronic Commerce
  • Electronic Signature Generator
  • EMV® Banking
  • Pay-per-Play
  • PCI Terminals
  • PIN Pads
  • Secure Access Control
  • Secure Data Storage
Request Reliability Report for: MAXQ1851-KIT 
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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