MAX32666EVKIT

Evaluation Kit for the MAX32665/MAX32666/MAX32667/MAX32668


Please check latest availability status for a specific part variant.

Description

The MAX32665/MAX32666 EV kits provide platforms for evaluating the capabilities of the MAX32665/MAX32666 high-efficiency Arm® microcontroller and audio DSP for wearable and hearable device applications.

These EV kits evaluate all variants of the CTBGA IC. There is a socketed version for the secure IC and direct mount version for the nonsecure IC.

MAX32665EVKIT, MAX32666EVKIT: Board Photo MAX32665EVKIT, MAX32666EVKIT: Board Photo Enlarge+

Key Features

  • Bluetooth SMA connector with a 2.4GHz Hinged Whip Antenna
  • 1.28in 128 × 128 Monochrome TFT Display
  • 64MB XIP Flash
  • 1MB XIP RAM
  • Stereo Audio Codec with Line-In and Line-Out 3.5mm Jacks
  • Digital Audio Microphone
  • USB 2.0 Micro B Interface
  • USB 2.0 Micro B to Serial UARTs
    • Selection with Jumpers Between UART1 and UART2
  • Micro SD Card Interface
  • Select GPIOs Accessed Through a 0.1in Header
  • Access to the 8 Analog Inputs Through a 0.1in Header
  • Arm® or SWD JTAG 20-Pin Header
  • One-Wire RJ11 Port
  • MAX32665 Can Be Solely Sourced by a Coin Cell Battery
  • Board Power Provided by Either USB Port
  • Individual Power Measurement on All IC Rails Through Jumpers
  • On-Board 1.8V and 3.3V Regulators
  • Two General-Purpose LEDs and Two General-Purpose Pushbutton Switches

Applications/Uses

  • Connected Home
  • Gaming Devices
  • Hearables
  • Industrial Sensors
  • Payment/Fitness/Medical Wearables
  • Telemedicine

Quality and Environmental Data

Lead-Free Package Tin (Sn) Whisker Reports
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

Quality Management System >
Environmental Management System >

 
Status:
Package:
Temperature:

Related Resources


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  • Secure Element
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MAX32570
Low-Power Arm Cortex-M4 Microcontroller with Contactless Radio for Secure Applications

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Belle Isle 2020
05/29/2020 - 05/31/2020, Detroit, MI
2020 Detroit Grand Prix - Chevrolet Detroit Grand Prix presented by Lear Fast Facts The Chevrolet Detroit Grand Prix presented by Lear was hosted on Belle Isle, May 29 - 30 2020. The event featured the cars of the NTT IndyCar Series, the IMSA WeatherTech SportsCar Championship and the Trans Am Series presented by Pirelli. The weekend is collectively referred to as the Chevrolet Detroit Grand Prix presented by Lear and it once again featured the Chevrolet Dual in Detroit IndyCar doubleheader.

RSVP