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Low-Power ARM Cortex-M4 with FPU-Based Microcontroller with Bluetooth 5 for Wearables

Generation UB MCUs are Built to Run Complex Applications Demanded by Battery-Powered and Wirelessly Connected Devices

Product Details

DARWIN is a new breed of low-power microcontrollers built to thrive in the rapidly evolving Internet of Things (IoT). They are smart, with the biggest memories in their class and a massively scalable memory architecture. They run forever, thanks to wearable-grade power technology. They are durable enough to withstand the most advanced cyberattacks. DARWIN microcontrollers are designed to run any application imaginable—in places where you would not dream of sending other microcontrollers.

Generation UB microcontrollers are designed to handle the increasingly complex applications demanded by today's advanced battery-powered devices and wirelessly connected devices, while providing robust hardware security and Bluetooth® 5 Low Energy (BLE) radio connectivity.

The MAX32665–MAX32668 UB class microcontrollers are advanced systems-on-chips featuring an Arm® Cortex®-M4 with FPU CPU for efficient computation of complex functions and algorithms with integrated power management. They also include the newest generation Bluetooth 5 Low Energy radio with high throughput (2Mbps) and Maxim's best-in-class hardware security suite trust protection unit (TPU). The devices offer large on-board memory with 1MB flash and up to 560KB SRAM that can be configured as 448KB SRAM with error correction coding (ECC). Split flash banks of 512KB each support seamless over the air upgrades, adding an additional degree of reliability. Memory scalability of data (SRAM) and code (flash) space is supported by two SPI execute-in-place (SPIX) interfaces.

Multiple high-speed interfaces are supported including HS-USB, secure digital interface (SD, SDIO, MMC, SDHC, and microSD™), SPI, UART, and I2C serial interfaces, and an audio subsystem supporting PDM, PCM, I2S, and TDM interfaces. An 8-input, 10-bit ADC is available to monitor analog inputs from external sensors and meters. The devices are available in 109-bump WLP (0.35mm pitch) and 121-bump CTBGA (0.65mm pitch).

Key Features

  • High-Efficiency Microcontroller and Audio DSP for Wearable and Hearable Devices
    • Arm Cortex-M4 with FPU Up to 96MHz
    • Optional Second Arm Cortex-M4 with FPU Optimized for Data Processing
    • Low-Power 7.3728MHz System Clock Option
    • 1MB Flash, Organized into Dual Banks 2 x 512KB
    • 560KB (448KB ECC) SRAM; 3 x 16KB Cache
    • Optional Error Correction Code (ECC-SEC-DED) for Cache, SRAM, and Internal Flash
  • Bluetooth 5 Low Energy Radio
    • 1Mbps and 2Mbps Data Throughput
    • Long Range (125kbps and 500kbps)
    • Advertising Extension
    • Rx Sensitivity: -95dbm; Tx Power Up to +4.5dbm
    • On-Chip Matching with Single-Ended Antenna Port
  • Power Management Maximizes Operating Time for Battery Applications
    • Integrated SIMO SMPS for Coin-Cell Operation
    • Dynamic Voltage Scaling Minimizes Active Core Power Consumption
    • 27.3µA/MHz at 3.3V Executing from Cache
    • Selectable SRAM Retention in Low Power Modes with RTC Enabled
  • Multiple Peripherals for System Control
    • Three QSPI Master/Slave with Three Chip Selects Each, Three 4-Wire UARTs, Three I2C Master/Slave, Up to 50 GPIOs
    • QSPI (SPIXF) with Real-Time Flash Decryption
    • QSPI (SPIXR) RAM Interface Provides SRAM Expansion
    • 8-Input, 10-Bit Delta-Sigma ADC 7.8ksps
    • USB 2.0 HS Engine with Internal Transceiver
    • PDM Interface Supports Two Digital Microphones
    • I2S with TDM, Six 32-Bit Timers, Two High-Speed Timers, 1-Wire Master, Sixteen Pulse Train (PWM) Engines
    • Secure Digital Interface Supports SD3.0/SDIO3.0/eMMC4.51
  • Secure Valuable IP/Data with Hardware Security
    • Trust Protection Unit (TPU) with MAA Supports Fast ECDSA and Modular Arithmetic
    • AES128/192/256, DES, 3DES, Hardware Accelerator
    • TRNG Seed Generator, SHA-2 Accelerator
    • Secure Bootloader

Applications/Uses

  • Connected Home
  • Gaming Devices
  • Hearables
  • Industrial Sensors
  • Payment/Fitness/Medical Wearables
  • Telemedicine

Simplified Block Diagram

MAX32665, MAX32666, MAX32667, MAX32668: Simplified Block Diagram MAX32665, MAX32666, MAX32667, MAX32668: Simplified Block Diagram Zoom icon

Technical Docs

Design & Development

Click any title below to view the detail page where available.

Description

The MAX32665/MAX32666 EV kits provide platforms for evaluating the capabilities of the MAX32665/MAX32666 high-efficiency Arm® microcontroller and audio DSP for wearable and hearable device applications.

These EV kits evaluate all variants of the CTBGA IC. There is a socketed version for the secure IC and direct mount version for the nonsecure IC.

View Details

Features

  • Bluetooth SMA connector with a 2.4GHz Hinged Whip Antenna
  • 1.28in 128 × 128 Monochrome TFT Display
  • 64MB XIP Flash
  • 1MB XIP RAM
  • Stereo Audio Codec with Line-In and Line-Out 3.5mm Jacks
  • Digital Audio Microphone
  • USB 2.0 Micro B Interface
  • USB 2.0 Micro B to Serial UARTs
    • Selection with Jumpers Between UART1 and UART2
  • Micro SD Card Interface
  • Select GPIOs Accessed Through a 0.1in Header
  • Access to the 8 Analog Inputs Through a 0.1in Header
  • Arm® or SWD JTAG 20-Pin Header
  • One-Wire RJ11 Port
  • MAX32665 Can Be Solely Sourced by a Coin Cell Battery
  • Board Power Provided by Either USB Port
  • Individual Power Measurement on All IC Rails Through Jumpers
  • On-Board 1.8V and 3.3V Regulators
  • Two General-Purpose LEDs and Two General-Purpose Pushbutton Switches

Description

The MAX32665/MAX32666 EV kits provide platforms for evaluating the capabilities of the MAX32665/MAX32666 high-efficiency Arm® microcontroller and audio DSP for wearable and hearable device applications.

These EV kits evaluate all variants of the CTBGA IC. There is a socketed version for the secure IC and direct mount version for the nonsecure IC.

View Details

Features

  • Bluetooth SMA connector with a 2.4GHz Hinged Whip Antenna
  • 1.28in 128 × 128 Monochrome TFT Display
  • 64MB XIP Flash
  • 1MB XIP RAM
  • Stereo Audio Codec with Line-In and Line-Out 3.5mm Jacks
  • Digital Audio Microphone
  • USB 2.0 Micro B Interface
  • USB 2.0 Micro B to Serial UARTs
    • Selection with Jumpers Between UART1 and UART2
  • Micro SD Card Interface
  • Select GPIOs Accessed Through a 0.1in Header
  • Access to the 8 Analog Inputs Through a 0.1in Header
  • Arm® or SWD JTAG 20-Pin Header
  • One-Wire RJ11 Port
  • MAX32665 Can Be Solely Sourced by a Coin Cell Battery
  • Board Power Provided by Either USB Port
  • Individual Power Measurement on All IC Rails Through Jumpers
  • On-Board 1.8V and 3.3V Regulators
  • Two General-Purpose LEDs and Two General-Purpose Pushbutton Switches

Description

The MAX32666FTHR board is a rapid development platform to help engineers quickly implement battery opti- mized Bluetooth® 5 solutions with the MAX32666 Arm® Cortex®-M4 processor with FPU. The board also includes the MAX1555 1-Cell Li+ battery charger for battery management. The form factor is a small 0.9in by 2.0in dual- row header footprint that is compatible with breadboards and off-the-shelf peripheral expansion boards. The board also includes a variety of peripherals, such as a micro SD card connector, 6-axis accelerometer/gyro, RGB indica- tor LED, and pushbutton. This platform provides power- optimized flexible for quick proof-of-concepts and early software development to enhance time to market.

View Details

Features

  • MAX32666 Microcontroller
    • Dual Arm Cortex-M4F, 96MHz
    • 1MB Flash Memory
    • 560KB SRAM
    • 3 x 16KB Cache
    • Bluetooth 5 Low Energy Radio
    • High-Speed USB 2.0
    • Three QSPI Master/Slave
    • Three I2C Master/Slave
    • Three UARTS
    • SD/SDIO 3.0
    • 1-Wire® Master
    • 48 GPIO
    • 8 Input, 10-Bit ADC
  • MAX1555 1-Cell Li+ Battery Charger
    • Charge from USB
    • On-Chip Thermal Limiting
    • Charge Status Indicator
  • Expansion Connections
    • Breadboard Compatible Headers
    • 10-Pin Cortex Debug Header
    • Micro USB Connector
    • Micro SD Card Connector
  • Integrated Peripherals
    • RGB Indicator LED
    • User Pushbutton
    • 6-Axis Accelerometer/Gyro
    • Bluetooth Surface Mount Antenna
  • SWD/MAXDAP Debug Interface
    • Drag-and-Drop Programming
    • SWD Debugger
    • Virtual UART Console

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    Parameters

    Parametric specs for Microcontrollers
    MCU Core Dual ARM Cortex-M4F
    Internal Flash (KBytes) 1024
    Core Clock Speed (MHz) (max) 96
    Data Processing 32-bit
    Internal SRAM (KBytes) 560
    Package/Pins CTBGA-CU/121
    WLP/109
    Budgetary
    Price (See Notes)
    $5.99 @1k

    Key Features

    • High-Efficiency Microcontroller and Audio DSP for Wearable and Hearable Devices
      • Arm Cortex-M4 with FPU Up to 96MHz
      • Optional Second Arm Cortex-M4 with FPU Optimized for Data Processing
      • Low-Power 7.3728MHz System Clock Option
      • 1MB Flash, Organized into Dual Banks 2 x 512KB
      • 560KB (448KB ECC) SRAM; 3 x 16KB Cache
      • Optional Error Correction Code (ECC-SEC-DED) for Cache, SRAM, and Internal Flash
    • Bluetooth 5 Low Energy Radio
      • 1Mbps and 2Mbps Data Throughput
      • Long Range (125kbps and 500kbps)
      • Advertising Extension
      • Rx Sensitivity: -95dbm; Tx Power Up to +4.5dbm
      • On-Chip Matching with Single-Ended Antenna Port
    • Power Management Maximizes Operating Time for Battery Applications
      • Integrated SIMO SMPS for Coin-Cell Operation
      • Dynamic Voltage Scaling Minimizes Active Core Power Consumption
      • 27.3µA/MHz at 3.3V Executing from Cache
      • Selectable SRAM Retention in Low Power Modes with RTC Enabled
    • Multiple Peripherals for System Control
      • Three QSPI Master/Slave with Three Chip Selects Each, Three 4-Wire UARTs, Three I2C Master/Slave, Up to 50 GPIOs
      • QSPI (SPIXF) with Real-Time Flash Decryption
      • QSPI (SPIXR) RAM Interface Provides SRAM Expansion
      • 8-Input, 10-Bit Delta-Sigma ADC 7.8ksps
      • USB 2.0 HS Engine with Internal Transceiver
      • PDM Interface Supports Two Digital Microphones
      • I2S with TDM, Six 32-Bit Timers, Two High-Speed Timers, 1-Wire Master, Sixteen Pulse Train (PWM) Engines
      • Secure Digital Interface Supports SD3.0/SDIO3.0/eMMC4.51
    • Secure Valuable IP/Data with Hardware Security
      • Trust Protection Unit (TPU) with MAA Supports Fast ECDSA and Modular Arithmetic
      • AES128/192/256, DES, 3DES, Hardware Accelerator
      • TRNG Seed Generator, SHA-2 Accelerator
      • Secure Bootloader

    Applications/Uses

    • Connected Home
    • Gaming Devices
    • Hearables
    • Industrial Sensors
    • Payment/Fitness/Medical Wearables
    • Telemedicine

    Description

    DARWIN is a new breed of low-power microcontrollers built to thrive in the rapidly evolving Internet of Things (IoT). They are smart, with the biggest memories in their class and a massively scalable memory architecture. They run forever, thanks to wearable-grade power technology. They are durable enough to withstand the most advanced cyberattacks. DARWIN microcontrollers are designed to run any application imaginable—in places where you would not dream of sending other microcontrollers.

    Generation UB microcontrollers are designed to handle the increasingly complex applications demanded by today's advanced battery-powered devices and wirelessly connected devices, while providing robust hardware security and Bluetooth® 5 Low Energy (BLE) radio connectivity.

    The MAX32665–MAX32668 UB class microcontrollers are advanced systems-on-chips featuring an Arm® Cortex®-M4 with FPU CPU for efficient computation of complex functions and algorithms with integrated power management. They also include the newest generation Bluetooth 5 Low Energy radio with high throughput (2Mbps) and Maxim's best-in-class hardware security suite trust protection unit (TPU). The devices offer large on-board memory with 1MB flash and up to 560KB SRAM that can be configured as 448KB SRAM with error correction coding (ECC). Split flash banks of 512KB each support seamless over the air upgrades, adding an additional degree of reliability. Memory scalability of data (SRAM) and code (flash) space is supported by two SPI execute-in-place (SPIX) interfaces.

    Multiple high-speed interfaces are supported including HS-USB, secure digital interface (SD, SDIO, MMC, SDHC, and microSD™), SPI, UART, and I2C serial interfaces, and an audio subsystem supporting PDM, PCM, I2S, and TDM interfaces. An 8-input, 10-bit ADC is available to monitor analog inputs from external sensors and meters. The devices are available in 109-bump WLP (0.35mm pitch) and 121-bump CTBGA (0.65mm pitch).

    Simplified Block Diagram

    MAX32665, MAX32666, MAX32667, MAX32668: Simplified Block Diagram MAX32665, MAX32666, MAX32667, MAX32668: Simplified Block Diagram Zoom icon

    Technical Docs

    Support & Training

    Search our knowledge base for answers to your technical questions.

    Filtered Search

    Our dedicated team of Applications Engineers are also available to answer your technical questions. Visit our support portal