Evaluation Kit for the MAX32665/MAX32666/MAX32667/MAX32668

Please check latest availability status for a specific part variant.


The MAX32665/MAX32666 EV kits provide platforms for evaluating the capabilities of the MAX32665/MAX32666 high-efficiency Arm® microcontroller and audio DSP for wearable and hearable device applications.

These EV kits evaluate all variants of the CTBGA IC. There is a socketed version for the secure IC and direct mount version for the nonsecure IC.

MAX32665EVKIT, MAX32666EVKIT: Board Photo MAX32665EVKIT, MAX32666EVKIT: Board Photo Enlarge+

Key Features

  • Bluetooth SMA connector with a 2.4GHz Hinged Whip Antenna
  • 1.28in 128 × 128 Monochrome TFT Display
  • 64MB XIP Flash
  • Stereo Audio Codec with Line-In and Line-Out 3.5mm Jacks
  • Digital Audio Microphone
  • USB 2.0 Micro B Interface
  • USB 2.0 Micro B to Serial UARTs
    • Selection with Jumpers Between UART1 and UART2
  • Micro SD Card Interface
  • Select GPIOs Accessed Through a 0.1in Header
  • Access to the 8 Analog Inputs Through a 0.1in Header
  • Arm® or SWD JTAG 20-Pin Header
  • One-Wire RJ11 Port
  • MAX32665 Can Be Solely Sourced by a Coin Cell Battery
  • Board Power Provided by Either USB Port
  • Individual Power Measurement on All IC Rails Through Jumpers
  • On-Board 1.8V and 3.3V Regulators
  • Two General-Purpose LEDs and Two General-Purpose Pushbutton Switches


  • Connected Home
  • Gaming Devices
  • Hearables
  • Industrial Sensors
  • Payment/Fitness/Medical Wearables
  • Telemedicine
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

Quality Management System >
Environmental Management System >


Related Resources

High Reliability, Ultra-Low Power Microcontroller Powered by Arm Cortex M4 Processor with FPU for Industrial and IoT

  • High-Efficiency Microcontroller for Low Power, High Reliability Devices
  • Flexible Clocking Schemes
  • Power Management Maximizes Uptime for Battery Applications

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