MAX32660-EVSYS

Evaluation System for the MAX32660


Please check latest availability status for a specific part variant.

Description

The MAX32660 evaluation system offers a compact development platform that provides access to all the features of the MAX32660 in a tiny, easy to use board. A MAX32625PICO-based debug adapter comes attached to the main board. It can be snapped free when programming is complete. The debug module supports an optional 10-pin Arm® Cortex® debug connector for DAPLink functionality. Combined measurements are 0.65in x 2.2in, while the main board alone measures 0.65in x 0.95in. External connections terminate in a dual-row header footprint compatible with both thru-hole and SMT applications. This board provides a powerful processing subsystem in a very small space that can be easily integrated into a variety of applications.

MAX32660-EVSYS: Board Photo MAX32660-EVSYS: Board Photo Enlarge+

Key Features

  • MAX32660 Microcontroller
    • Arm Cortex-M4F, 96MHz
    • 256KB Flash Memory
    • 96KB SRAM
    • 16KB Instruction Cache
    • Two SPIs
    • Two I2Cs
    • Two UARTs
    • 14 GPIOs
  • DIP Breakout Board
    • 100mil Pitch Dual Inline Pin Headers
    • Breadboard Compatible
  • Integrated Peripherals
    • Red Indicator LED
    • User Pushbutton
  • MAX32625PICO-Based Debug Adapter
    • CMSIS-DAP SWD Debugger
    • Virtual UART Console

Applications/Uses

  • Fitness Monitors
  • Industrial Sensors
  • IoT
  • Optical Modules: QSFP-DD, QSFP, 400G
  • Portable Medical Devices
  • Sports Watches
  • Wearable Medical Patches

Quality and Environmental Data

Request Reliability Report for: MAX32660-EVSYS 
Lead-Free Package Tin (Sn) Whisker Reports
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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Belle Isle 2020
05/29/2020 - 05/31/2020, Detroit, MI
2020 Detroit Grand Prix - Chevrolet Detroit Grand Prix presented by Lear Fast Facts The Chevrolet Detroit Grand Prix presented by Lear was hosted on Belle Isle, May 29 - 30 2020. The event featured the cars of the NTT IndyCar Series, the IMSA WeatherTech SportsCar Championship and the Trans Am Series presented by Pirelli. The weekend is collectively referred to as the Chevrolet Detroit Grand Prix presented by Lear and it once again featured the Chevrolet Dual in Detroit IndyCar doubleheader.

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