MAX32625MBED ARM mbed Enabled Development Platform for the MAX32625

Please check latest availability status for a specific part variant.


The MAX32625MBED provides a convenient platform for evaluating the capabilities of the MAX32625 microcontroller. The MAX32625MBED also provides a complete, functional system ideal for developing and debugging applications.

The MAX32625MBED includes a MAX32625 ARM® Cortex®-M4 microcontroller with FPU, prototyping area with adjacent access to precision analog front end (AFE) connections, I/O access through Arduino®-compatible connectors, additional I/O access through 100mil x 100mil headers, USB interface, and other general-purpose I/O devices.

Go to to get started developing with this board.

How to Setup the MAX32625MBED Board with the Arduino IDE

Using the MAX32625MBED with Rowley CrossStudio

MAX32625MBED: Board Photo MAX32625MBED: Board Photo Enlarge+

Key Features

  • Arduino-Compatible Headers and mbed Support Enable Rapid Prototyping of Low-Power Embedded Systems
  • MAX32625 Microcontroller
    • 96MHz ARM Cortex-M4 Microcontroller with FPU
    • 512KB Flash Memory
    • 160KB SRAM
    • 8KB Instruction Cache
    • Full-Speed USB 2.0
    • Three SPI Masters, One Slave
    • Two I2C Masters, One Slave
    • Three UARTs
    • 1-Wire Master
    • 40 GPIOs
    • Four Input 10-Bit ADC
  • Expansion Connections
    • Arduino Form-Factor Headers
    • MicroSD Card Connector
    • Micro-USB Connectors
    • Prototyping Area
  • Integrated Peripherals
    • 4x User Indicator LED
    • 2x User Pushbutton
  • Integrated DAPLink Programming Adapter
    • Drag-and-Drop Programming
    • CMSIS-DAP SWD Debugger
    • USB Virtual UART


  • Fitness Monitors
  • Portable Medical Devices
  • Sensor Hubs
  • Sports Watches
  • Wearable Medical Patches

Technical Documents

User Guide 6575 MAXREFDES168# User Guide

Quality and Environmental Data

Request Reliability Report for: MAX32625MBED 
Lead-Free Package Tin (Sn) Whisker Reports

Additional Resources

ECDSA Asymmetric Crypto Security with ChipDNA PUF Protection ›

Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

Quality Management System >
Environmental Management System >


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Type ID PDF Title
User Guide 6575 MAXREFDES168# User Guide