MAX32600

Wellness Measurement Microcontroller

Ultra-Low-Power ARM Cortex-M3 with Wellness Sensor Analog Front-End and Advanced Hardware Security


Please check latest availability status for a specific part variant.

Description

2014 Wasp Award WinnerThe MAX32600 microcontroller is based on the industry-standard ARM® Cortex®-M3 32-bit RISC CPU operating at up to 24MHz. It includes 256KB of flash memory, 32KB of SRAM, a 2KB instruction cache, and integrated high-performance analog peripherals.

The MAX32600 is available in the following package options: 192-ball, 12mm x 12mm CTBGA; 120-ball, 7mm x 7mm CTBGA; and 108-ball, 5.4mm x 4.3mm WLP.

In addition to the free tools provided by Maxim, the MAX32600 supports the Embedded Workbench from IAR. The IAR Embedded Workbench® incorporates a compiler, an assembler, a linker, and a debugger into one IDE. It is easy to use, provides advanced and highly-efficient optimization features, and is highly integrated with hardware, RTOS products, and middleware. The IAR Embedded Workbench for ARM is available in several versions, including a product package that is designed specifically for ARM Cortex-M core families.

MAX32600: Simplified Functional Diagram MAX32600: Simplified Functional Diagram Enlarge+

Key Features

  • Integrated AFE Enables Precision Wellness Measurements with Minimal Discretes
    • 16-Bit ADC with Input Mux and PGA
      • Up to 500ksps Conversion Rate
      • PGA with Gain of 1, 2, 4, and 8 and Bypass Mode
      • Differential 8:1 or Single-Ended 16:1 Input Mux
      • Internal Mux Inputs for Measuring VDDA3
    • Internal or External Voltage Reference
      • Programmable Buffers for ADC and DACs
    • Two 12-Bit DACs and Two 8-Bit DACs
    • Four Operational Amplifiers
    • Four Low-Power Comparators
    • Four Uncommitted SPST Analog Switches
    • Four Ground Switches
    • Up to Eight 100mA LED Driver Pairs (Sink)
    • Internal Temperature Sensor
  • Secure Valuable IP and Data with Robust On-Board Trust Protection Unit
    • Trust Protection Unit for End-to-End Security
    • AES Hardware Engine
    • µMAA for ECDSA and RSA
    • True Random Number Generator (TRNG)
    • Fast-Erase SRAM for Secure Key Storage
  • Industry’s Lowest Overall System Power Increases Battery Life
    • 175µA/MHz Active Power Executing Code from Cache
    • 1.25µA Current Consumption with Real-Time Clock Enable in LP0
    • 1.8µA Current Consumption with Data Retention and Fast 15µs Wakeup in LP1
    • Peripheral Clock Control
    • 6-Channel DMA Engine Enables Intelligent Peripheral Operation While Micro is in Sleep Mode
  • Flexible Package Options
    • 120-Ball CTBGA, 0.5mm Pitch, 7mm x 7mm
    • 192-Ball CTBGA, 0.65mm Pitch, 12mm x 12mm
    • 108-Bump WLP, 0.4mm Pitch, 5.4mm x 4.3mm

Applications/Uses

  • Blood Glucose Metering
  • Galvanic Skin Response Measurement
  • Pulse Oximetry Measurement
  • Wearable Medical Devices
Part NumberMCU CoreCore Clock Speed
(MHz)
Data ProcessingInternal Flash
(KBytes)
Internal SRAM
(KBytes)
USARTsSPI BusI2C BusUSBGPIO PinsPWMTimer FeaturesPackage/Pins
maxmax
MAX32600 ARM Cortex-M32432-bit25632232 Master, 1 Slave
1 x 2.0 FS Device
Device Including Transceiver
644
Brownout Monitor
Capture/Compare
RTC
Wake Up Timer
Watchdog
Windowed Watchdog
CTBGA/120
CTBGA/192
WLP/108
See All Microcontrollers (59)
Pricing Notes:
This pricing is BUDGETARY, for comparing similar parts. Prices are in U.S. dollars and subject to change. Quantity pricing may vary substantially and international prices may differ due to local duties, taxes, fees, and exchange rates. For volume-specific and version-specific prices and delivery, please see the price and availability page or contact an authorized distributor.


MAX32600-KIT: Evaluation Kit for the MAX32600
MAX32600MBED: ARM mbed Enabled Development Platform for MAX32600

CAD Symbols and Footprints

  • MAX32600-J85A+
  • MAX32600-J85B+
  • MAX32600-P00+
  • MAX32600-P85A+
  • MAX32600-P85B+
  • MAX32600-W85A+
  • MAX32600-W85A+T
  • MAX32600-W85B+
  • MAX32600-W85B+T
  • Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

    Quality Management System >
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