MAX32520-KIT

Evaluation Kit for the MAX32520


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Description

The MAX32520 evaluation kit (EV kit) provides a platform for evaluation capabilities of the MAX32520 for secure element IoT utilizing Maxim’s proprietary PUF (physically unclonable function) technology.

The MAX32520 integrates an Arm® Cortex® M4 processor with FPU, 2MB of flash, 136KB of system RAM and 34KB ECC, 8KB of one-time-programmable (OTP) memory and 128KB of boot ROM. It provides a FIPS/ compliant TRNG, as well as environmental and tamper detection circuitry to facilitate system-level security. Multiple high speed interfaces are supported including SPI, UART, and an I2C. One of the SPI ports has a serial flash emulation mode allowing direct code fetching enabling secure boot from a host microcontroller.

MAX32520-KIT: Board Photo MAX32520-KIT: Board Photo Enlarge+

Key Features

  • Arm® Cortex® M4 Processor with FPU with ChipDNA™ PUF Technology
  • USB 2.0 Micro B to Serial UART
  • Serial UART Access Selectable Through a USB 2.0 Serial Bridge or from an Optional Host Processor
  • Security Self-Destruct Jumper
  • Arm® or SWD JTAG 20-Pin Header and Cortex 10-Pin Header
  • 40-Pin Connector for Interfacing to a Host Processor
  • 16-Pin Ribbon Cable Connector for Interfacing to QSPI
  • Three PMOD Connectors for Interfacing to SPI, I2C, or Timer Modules
  • Select GPIOs Accessed Through Shared 0.1in Headers
  • Board Power Provided by Either USB Port or from a Host Processor
  • Onboard 1.8V, 2.5V, and 3.3V Regulators for IC and Peripherals
  • Individual Power Measurement on All IC Rails Through Jumpers
  • Two General-Purpose LEDs and One General- Purpose Pushbutton Switch

Applications/Uses

  • Embedded Communication Equipment (Routers, Gateways, etc.)
  • Embedded Connected Systems
  • IoT Nodes and Gateways
  • Secure Industrial Appliances, Sensors, and Controllers
  • Set-Top Boxes

Tools & Models

  • MAX32520-KIT Gerber Files
  • Request Reliability Report for: MAX32520-KIT 
    Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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