MAX3345EEVKIT

Evaluation Kit for the MAX3344E, MAX3345E


Please check latest availability status for a specific part variant.

Description

The MAX3345E evaluation kit (EV kit) is a fully assembled and tested surface-mount circuit board that evaluates the MAX3345E USB level translator. The EV kit includes TSSOP and UCSP™ versions of the MAX3345E IC, which are configured as a master and slave unit, respectively. The EV kit is designed to be driven by the on-board single-ended/differential driver, or directly connected to a microcontroller (µC) or application- specific integrated circuit (ASIC).

Key Features

  • USB 1.1 Full-Speed Compliant (12Mbps)
  • Single-Supply Operation
  • Low-Profile (1.0mm max) Design
  • On-Board Oscillator
  • Included USB A-B Cable
  • Jumper-Selectable Master/Slave Configuration
  • Fully Assembled and Tested
  • Also Evaluates MAX3344E
  • Quality and Environmental Data

    Lead-Free Package Tin (Sn) Whisker Reports
    Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

    Quality Management System >
    Environmental Management System >

     
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    05/29/2020 - 05/31/2020, Detroit, MI
    2020 Detroit Grand Prix - Chevrolet Detroit Grand Prix presented by Lear Fast Facts The Chevrolet Detroit Grand Prix presented by Lear was hosted on Belle Isle, May 29 - 30 2020. The event featured the cars of the NTT IndyCar Series, the IMSA WeatherTech SportsCar Championship and the Trans Am Series presented by Pirelli. The weekend is collectively referred to as the Chevrolet Detroit Grand Prix presented by Lear and it once again featured the Chevrolet Dual in Detroit IndyCar doubleheader.

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