2-/4-/6-/8-Channel ±30kV ESD Protectors in µDFN

Please check latest availability status for a specific part variant.


The MAX13202E/MAX13204E/MAX13206E/MAX13208E low-capacitance ±30kV ESD-protection diode arrays are designed to protect sensitive electronics attached to communication lines. Each channel consists of a pair of diodes that steer ESD current pulses to VCC or GND.

The MAX13202E/MAX13204E/MAX13206E/MAX13208E protect against ESD pulses up to ±15kV Human Body Model (HBM) and ±30kV Air-Gap Discharge, as specified in IEC 61000-4-2. These devices have a 6pF on-capacitance per channel, making them ideal for use on high-speed data I/O interfaces.

The MAX13204E is a quad-ESD structure designed for Ethernet and FireWire® applications. The MAX13202E/MAX13206E/MAX13208E are 2-channel, 6-channel, and 8-channel devices. They are designed for cellphone connectors and SVGA video connections.

These devices are available in 6-, 8-, and 10-pin µDFN packages and are specified over the -40°C to +125°C automotive operating temperature range.
MAX13202E, MAX13204E, MAX13206E, MAX13208E: Typical Operating Circuit MAX13202E, MAX13204E, MAX13206E, MAX13208E: Typical Operating Circuit Enlarge+

Key Features

  • High-Speed Data-Line ESD Protection
    • ±15kV—Human Body Model
    • ±30kV—IEC 61000-4-2, Air-Gap Discharge
  • Tiny µDFN Package
    • MAX13202E (1mm x 1.5mm)
    • MAX13204E (2mm x 2mm)
    • MAX13206E (2mm x 2mm)
    • MAX13208E (2mm x 2mm)
  • Low 6pF Input Capacitance
  • Low 1nA (max) Leakage Current
  • +0.9V to +16V Supply Voltage Range


  • Cell Phones
  • Ethernet
  • FireWire®
  • PDAs
  • USB
  • USB 2.0
  • Video

Pricing Notes:
This pricing is BUDGETARY, for comparing similar parts. Prices are in U.S. dollars and subject to change. Quantity pricing may vary substantially and international prices may differ due to local duties, taxes, fees, and exchange rates. For volume-specific and version-specific prices and delivery, please see the price and availability page or contact an authorized distributor.
Product Reliability Reports: MAX13204E.pdf 
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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