MAX14975

Robust Dual USB 3.0 Equalizer/Redriver with Extended Temperature Operation

Save Power While Supporting SuperSpeed USB 3.0 Interface in a Ruggedized Design


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Description

The MAX14975 dual SuperSpeed USB 3.0 equalizer/redriver utilizes programmable input equalization and output deemphasis to reduce deterministic jitter and restore signal loss caused by circuit-board or signal-cable losses, and allows optimal placement of key SuperSpeed USB 3.0 components and longer circuit-board traces or cables. The device features advanced power management with receiver detection and explicit support for USB 3.0 low-frequency periodic signals (LFPS).

The device is available in a small, 24-pin (4.0mm x 4.0mm) TQFN package with flow-through traces for optimal layout and minimal space requirements. The device is specified over the -40°C to +85°C extended operating temperature range.
MAX14975: Typical Operating Circuit MAX14975: Typical Operating Circuit Enlarge+

Key Features

  • Advanced Power-Saving Sleep Modes
    • Standby State: < 1mW (typ)
    • Receiver Detect State: 23mW (typ)
    • Dynamic Power-Down State: 82.5mW (typ)
    • Active State: 304mW (typ)
  • High-Performance Solution Designed to Overcome Lossy Channels
    • Three Levels of Input Equalization Up to 10dB
    • Six Levels of Output Deemphasis Up to 4dB
    • Compensates Up to 30in of Channel Losses with Deterministic Jitter: 12psP-P (max); Random Jitter: 1psRMS (max)
    • 10dB (typ) of Return Loss Up to 2.5GHz
  • Designed to Reliably Operate in Harsh Environments
    • Industrial Temperature Rated: -40°C to + 85°C
    • ±8kV Human Body Model (HBM) ESD Protection on All Pins
    • Housed in a Flow-Through (4.0mm x 4.0mm, 24-Pin) TQFN Package for Resistance to Vibration/Shocks

Applications/Uses

  • Carrier Boards
  • Computer on Modules
  • Industrial/Embedded PC
  • Medical Equipment
  • Rack Server Industrial PCs
  • Test Equipment

Quality and Environmental Data

Product Reliability Reports: MAX14975.pdf 
Lead-Free Package Tin (Sn) Whisker Reports

Tools & Models

  • MAX14975 HSPICE Model
  • Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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