MAX3396E

±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/Octal-Level Translators with Speed-Up Circuitry


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Description

The MAX3394E/MAX3395E/MAX3396E bidirectional level translators provide level shifting required for data transfer in a multivoltage system. Internal slew-rate enhancement circuitry features 10mA current-sink and 15mA current-source drivers to isolate capacitive loads from lower current drivers. In open-drain systems, slew-rate enhancement enables fast data rates with larger pullup resistors and increased bus load capacitance. Externally applied voltages, VCC and VL, set the logic-high levels for the device. A logic-low signal on one I/O side of the device appears as a logic-low signal on the opposite I/O side, and vice-versa. Each I/O line is pulled up to VCC or VL by an internal pullup resistor, allowing the devices to be driven by either push-pull or open-drain drivers.

The MAX3394E/MAX3395E/MAX3396E feature a tri-state output mode, thermal-shutdown protection, and ±15kV Human Body Model (HBM) ESD protection on the VCC side for greater protection in applications that route signals externally.

The MAX3394E/MAX3395E/MAX3396E accept VCC voltages from +1.65V to +5.5V, and VL voltages from +1.2V to VCC, making them ideal for data transfer between low voltage ASIC/PLDs and higher voltage systems. The MAX3394E/MAX3395E/MAX3396E operate at a guaranteed data rate of 6Mbps with push-pull drivers and 1Mbps with open-drain drivers.

The MAX3394E is a dual-level translator available in 9-bump UCSP™ and 8-pin 3mm × 3mm TDFN packages. The MAX3395E is a quad-level translator available in 12-bump UCSP, and 12-pin 4mm x 4mm TQFN packages. The MAX3396E is an octal-level translator available in 20-bump UCSP and 20-pin 5mm × 5mm TQFN packages. The MAX3394E/MAX3395E/MAX3396E operate over the extended -40°C to +85°C temperature range.
MAX3394E, MAX3395E, MAX3396E: Typical Operating Circuit MAX3394E, MAX3395E, MAX3396E: Typical Operating Circuit Enlarge+

Key Features

  • ±15kV ESD Protection on I/O VCC_ Lines
  • Bidirectional Level Translation Without Direction Pin
  • I/O VL_ and I/O VCC_ 10mA Sink-/15mA Source-Current Capability
  • Slew-Rate Enhancement Circuitry Supports Larger Capacitive Loads or Larger External Pullup Resistors
  • 6Mbps Push-Pull/1Mbps Open-Drain Guaranteed Data Rate
  • Wide Supply-Voltage Range: Operation Down to +1.2V on VL and +1.65V on VCC
  • Low Supply Current in Tri-State Output Mode (3µA typ)
  • Low Quiescent Current
  • Thermal-Shutdown Protection
  • UCSP, TDFN, and TQFN Packages

Applications/Uses

  • Cell Phones
  • High-Speed Bus Fan-Out Expansion
  • Multivoltage Bidirectional Level Translation
  • Open-Drain Rise-Time Speed Up
  • SPI™, MICROWIRE™, and I²C Level Translation
  • Telecom, Networking, Server, RAID/SAN
Part NumberLevel Transl.VL
(V)
VCC
(V)
Data Rate
(Mbps)
I/O VCC StateI/O VL StateICC
(µA)
VL
(µA)
ICC (Shutdown)
(µA)
IL (Shutdown)
(µA)
Package/PinsBudgetary
Price
maxShutdn.Shutdn.maxmaxmaxmaxSee Notes
MAX3394E 21.2 to 5.51.65 to 5.56High ImpedanceHigh Impedance1503030.7
TDFN/8
UCSP (B)/9
$1.60 @1k
MAX3395E 4300
TQFN/12
UCSP (B)/12
$4.07 @1k
See All Logic Level Translators (39)
Pricing Notes:
This pricing is BUDGETARY, for comparing similar parts. Prices are in U.S. dollars and subject to change. Quantity pricing may vary substantially and international prices may differ due to local duties, taxes, fees, and exchange rates. For volume-specific and version-specific prices and delivery, please see the price and availability page or contact an authorized distributor.

Quality and Environmental Data

Request Reliability Report for: MAX3396E 
Lead-Free Package Tin (Sn) Whisker Reports
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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