The MAX22700–MAX22702 evaluation kits (EV kits) provide a proven design to evaluate the MAX22700– MAX22702 family of single-channel isolated gate drivers with ultra-high common-mode transient immunity (CMTI) of 300kV/µs (typ). Two identical channels (devices) are included on the EV kit in order to demonstrate the very tight part-to-part propagation delay matching of 2ns (max) over the -40°C to +125°C operating temperature range.
Two types of evaluation kits, MAX22701EVKIT# and MAX22702EVKIT#, are available to support variants with different B-side options, gate driver common pin GNDB (MAX22700), Miller Clamp pin (MAX22701), and adjustable undervoltage-lockout pin (MAX22702). In addition, both EV kits support variants with different A-side options, differential inputs (D versions), or a single-ended input with an enable pin (E versions). Both evaluation boards come with the narrow-body 8-pin SOIC package type. See Table 1 for EV kit options.
The MAX22701EVKIT# is fully assembled and tested, and comes populated with the MAX22701EASA+ (see Figure 1). This board also supports the MAX22701DASA+, but requires the user to replace U1 and U2.
The MAX22702EVKIT# is fully assembled and tested, and comes populated with the MAX22702EASA+ (see Figure 2). This board also supports the MAX22700DASA+, MAX22700EASA+, and MAX22702DASA+ if the user replaces U1, U2, and necessary external components on the B side. See Table 3 and Evaluate MAX22700 on MAX22702EVKIT# section for details.
The EV kits should be powered from multiple independent isolated power supplies as required by the different power domains. The A side of the MAX22700–MAX22702 family has a nominal supply-voltage range from 3V to 5.5V. The B side has a nominal supply-voltage range of 13V to 36V or 6V to 36V depending upon the target device. For evaluating the electrical parameters of the devices without any isolation between the two sides and two devices, a common ground can be shared among different power domains.
Note: When ordering an EV kit, if the desired device is not the MAX22701EASA+ or the MAX22702EASA+, request samples of the desired MAX22700–MAX22702 IC that can be soldered to the PCB.
|Device||Fab Process||Technology||Sample size||Rejects||FIT at 25°C||FIT at 55°C|