Smart Card Interface

Industry-Standard Smart Card Interface Provides Robust Communication

Please check latest availability status for a specific part variant.


The DS8024 smart card interface IC is a low-cost, analog front-end for a smart card reader, designed for all ISO 7816, EMV®, and GSM11-11 applications. The DS8024 is a pin-for-pin drop-in replacement for the NXP TDA8024 and is offered in 28-pin TSSOP and SO packages.

Applications requiring support for 1.8V smart cards or requiring low power should consider the DS8113, which achieves lower active- and stop-mode power with minimal changes to application hardware and software.
DS8024: Typical Operating Diagram DS8024: Typical Operating Diagram Enlarge+

Key Features

  • Analog Interface and Level Shifting for IC Card Communication
  • ±8kV (min) ESD (IEC) Protection on Card Interfaces
  • Internal IC Card Supply-Voltage Generation:
    • 5.0V ±5%, 80mA (max)
    • 3.0V ±8%, 65mA (max)
  • Automatic Card Activation and Deactivation Controlled by Dedicated Internal Sequencer
  • I/O Lines from Host Directly Level Shifted for Smart Card Communication
  • Flexible Card Clock Generation, Supporting External Crystal Frequency Divided by 1, 2, 4, or 8
  • High-Current, Short-Circuit and High-Temperature Protection


  • Access Control
  • Automated Teller Machines
  • Banking Applications
  • Debit/Credit Payment Terminals
  • Pay/Premium Television
  • PIN Pads
  • POS Terminals
  • Set-Top Box Conditional Access
  • Telecommunications

See parametric specs for Smart Card Reader ICs (6)

Part NumberISO-7816InterfaceCard Supply Voltage
See Notes
DS8024 YesDigital I/O
SOIC (W)/28
$1.41 @1k

Pricing Notes:
This pricing is BUDGETARY, for comparing similar parts. Prices are in U.S. dollars and subject to change. Quantity pricing may vary substantially and international prices may differ due to local duties, taxes, fees, and exchange rates. For volume-specific and version-specific prices and delivery, please see the price and availability page or contact an authorized distributor.
Product Reliability Reports: DS8024.pdf 
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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