Single-Channel 1-Wire Master

 

Part Number	Replacement	Explanation

Description

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The DS2482-100 is an I²C to 1-Wire® bridge device that interfaces directly to standard (100kHz max) or fast (400kHz max) I²C masters to perform bidirectional protocol conversion between the I²C master and any downstream 1-Wire slave devices. Relative to any attached 1-Wire slave device, the DS2482-100 is a 1-Wire master. Internal factory trimmed timers relieve the system host processor from generating time-critical 1-Wire waveforms, supporting both standard and Overdrive 1-Wire communication speeds. To optimize 1-Wire waveform generation, the DS2482-100 performs slew rate control on rising and falling 1-Wire edges and provides additional programmable features to match drive characteristics to the 1-Wire slave environment. Programmable strong pullup features support 1-Wire power delivery to 1-Wire devices such as EEPROMs and sensors. The DS2482-100 combines these features with an output to control an external MOSFET for enhanced strong pullup application. The I²C slave address assignment is controlled by two binary address inputs, resolving potential conflicts with other I²C slave devices in the system.

DS2482-100: Typical Operating Circuit Enlarge+

Key Features

• Allows Easy Interface Between a I²C Microport and a 1-Wire Slave
  • I²C Host Interface Supports 100kHz and 400kHz I²C Communication Speeds
  • 1-Wire Master IO with Selectable Active or Passive 1-Wire Pullup
  • Provides Reset/Presence, 8-Bit, Single-Bit, and 3-Bit 1-Wire IO Sequences
  • Standard and Overdrive 1-Wire Communication Speeds
  • Two Address Inputs for I²C Address Assignment
• Minimizes Line Noise Reducing System EMI
  • Slew-Controlled 1-Wire Edges
• Supports EEPROMs, Temperature Sensors, or Other 1-Wire Slaves That Have Momentary High Source Current Modes
  • Strong 1-Wire Pullup Provided by an Internal Low-Impedance Signal Path
  • PCTLZ Output to Optionally Control an External MOSFET for Stronger Pullup Requirements
• Operating Range: 2.9V to 5.5V, -40°C to +85°C
• 8-Pin (150 mils) SO and 9-Bump WLP Packages

Applications/Uses

• Cell Phones/PDAs
• Industrial Sensors
• Medical Instruments
• Printers