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DS2482-100

DS2482-100

Single-Channel 1-Wire Master

I²C to 1-Wire Bridge Device that Interfaces Directly to Standard (100kHz max) or Fast (400kHz max) I²C Masters to Perform Bidirectional Protocol Conversion Between the I²C Master and Any Downstream 1-Wire Slave Device

Data Sheet
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Overview

Description

The DS2482-100 is an I²C to 1-Wire® bridge device that interfaces directly to standard (100kHz max) or fast (400kHz max) I²C masters to perform bidirectional protocol conversion between the I²C master and any downstream 1-Wire slave devices. Relative to any attached 1-Wire slave device, the DS2482-100 is a 1-Wire master. Internal factory trimmed timers relieve the system host processor from generating time-critical 1-Wire waveforms, supporting both standard and Overdrive 1-Wire communication speeds. To optimize 1-Wire waveform generation, the DS2482-100 performs slew rate control on rising and falling 1-Wire edges and provides additional programmable features to match drive characteristics to the 1-Wire slave environment. Programmable strong pullup features support 1-Wire power delivery to 1-Wire devices such as EEPROMs and sensors. The DS2482-100 combines these features with an output to control an external MOSFET for enhanced strong pullup application. The I²C slave address assignment is controlled by two binary address inputs, resolving potential conflicts with other I²C slave devices in the system.
DS2482-100: Typical Operating Circuit DS2482-100: Typical Operating Circuit Enlarge+

Key Features

  • Allows Easy Interface Between a I2C Microport and a 1-Wire Slave
    • I2C Host Interface Supports 100kHz and 400kHz I2C Communication Speeds
    • 1-Wire Master IO with Selectable Active or Passive 1-Wire Pullup
    • Provides Reset/Presence, 8-Bit, Single-Bit, and 3-Bit 1-Wire IO Sequences
    • Standard and Overdrive 1-Wire Communication Speeds
    • Two Address Inputs for I2C Address Assignment
  • Minimizes Line Noise Reducing System EMI
    • Slew-Controlled 1-Wire Edges
  • Supports EEPROMs, Temperature Sensors, or Other 1-Wire Slaves That Have Momentary High Source Current Modes
    • Strong 1-Wire Pullup Provided by an Internal Low-Impedance Signal Path
    • PCTLZ Output to Optionally Control an External MOSFET for Stronger Pullup Requirements
  • Operating Range: 2.9V to 5.5V, -40°C to +85°C
  • 8-Pin (150 mils) SO and 9-Bump WLP Packages

Applications/Uses

  • Cell Phones/PDAs
  • Industrial Sensors
  • Medical Instruments
  • Printers

Key Specs

Part Number Functions VSUPPLY
(V)		 Package/Pins Oper. Temp.
(°C)		 Budgetary
Price
See Notes
DS2482-100  1-Wire Bridge 2.9 to 5.5
SOIC(N)/8
WLP/9
 -40 to +85 $0.74 @1k
See All 1-Wire Interface Products (9)
Pricing Notes:
This pricing is BUDGETARY, for comparing similar parts. Prices are in U.S. dollars and subject to change. Quantity pricing may vary substantially and international prices may differ due to local duties, taxes, fees, and exchange rates. For volume-specific and version-specific prices and delivery, please see the price and availability page or contact an authorized distributor.

Design Resources

Technical Documents

App Note 6208 Extending I2C Communication Distance with the DS28E17
App Note 5273 Understanding and Configuring the DS2483 1-Wire® Master
App Note 5134 Implementing an Isolated 1-Wire Bus
Tutorial 4671 Improve Sensor Performance and SNR in Pulse Oximeter Designs
App Note 4478 How to Implement SHA-1 Based Secure Authentication and System Feature Settings
Reference Schematic 4206 Choosing the Right 1-Wire® Master for Embedded Applications
App Note 4037 Regain Location Information by Leveraging the 1-Wire® Chain Function—A Simple Signaling and Protocol Method Determines Device Physical Location
App Note 4002 Understanding Flip-Chip and Chip-Scale Package Technologies and Their Applications
App Note 3829 Determining the Recovery Time for Multiple-Slave 1-Wire® Networks
App Note 3684 How to Use the DS2482 I²C 1-Wire® Master
App Note 126 1-Wire Communication Through Software

Quality and Environmental Data

Product Reliability Reports: DS2482-100.pdf 
Lead-Free Package Tin (Sn) Whisker Reports

Quality And Environmental

Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

Quality Management System >
Environmental Management System >

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Related Resources

Related Products

Technical Docs

Reference Designs

Type ID Title
Reference Circuit4206Choosing the Right 1-Wire® Master for Embedded Applications