MAX72408

Dual SGPIO Backplane Controller

Hardware-Optimized Dual SGPIO (SFF-8485) Controller Allows Drive Enclosure Status Updates for Two Separate Domains


Please check latest availability status for a specific part variant.

Description

The MAX72408 is a dual serial general-purpose input/output (SGPIO) backplane controller. It is intended for system designers and software and firmware developers using this device to support enclosure management functions or other related I/O expansion tasks. The device can be used in any embedded control application including SAS or SATA where the monitoring of and control of a large number of digital I/O signals is required.

Key Features

  • Common Features
    • Dedicated Slave Mode I²C Interface
    • Autoload I²C Master Interface—Can Share with Up to Eight MAX72408 Devices
    • I²C Slave Interface—Can Share with Up to Eight MAX72408 Devices
    • Interrupt Output—Can Configure for Open Drain or Active Drive
    • High-Impedance Inputs (Nonclamping)
    • 5V Tolerant I/O Using 3.3V Technology
    • On-Board 3.3V to 1.8V LDO Regulator for Core Logic
    • Internal Power-On Reset
  • SGPIO Features
    • Support for Up to Eight Drives Per Device—Cascaded Devices Can Support Up to 64 Drives
    • Mated/Present and SATA Pin 11 Activity Input for Each Drive
    • Activity and Status Light-Emitting Diode (LED) Output for Each Drive
    • Implements SGPIO IBPI (SFF-8489 Rev 0.1)
    • Two 24-Bit SGPIO Master/Slave Interfaces
    • Operates in One of Three Modes for Dual or Single Slave Operation
  • GPIO Features
    • Eight Optional Fan-Speed Monitor Inputs
    • Eight Optional Pulse-Width-Modulation (PWM) Outputs
    • Up to 40 User-Defined Pulse-Train Outputs
    • Up to 40 Edge-Sensitive Inputs for Interrupt Generation
    • Up to 40 General-Purpose Input/Output (GPIO) Under User Control

Applications/Uses

  • IO Expansion Over I²C
  • SBB Storage Enclosures (JBODs)
  • Server-Based Hard Drive Backplanes

Quality and Environmental Data

Product Reliability Reports: MAX72408.pdf 
Lead-Free Package Tin (Sn) Whisker Reports
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

Quality Management System >
Environmental Management System >

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