Generation II Enhanced 6.0Gbps 18-PHY SAS Expander

Industry's Most Advanced 6.0Gbps SAS Expander

Please check latest availability status for a specific part variant.


The MAX72018C is a next-generation enhanced 18-PHY, serial-attached SCSI-2 (SAS-2)-compatible expander that operates at 1.5Gbps, 3.0Gbps, and 6.0Gbps (on a PHY-by-PHY basis). This device is used for server and enclosure applications for midrange- and enterprise-storage systems requiring active SAS port expansion.

This device offers an evolutionary upgrade path for systems that currently employ parallel SCSI technology and rely heavily on SCSI-centric software or management solutions. By combining industry-leading I/O, embedded enclosure functions, and a high-performance internal switching architecture, this device provides all the features needed to design, develop, and deploy high-performance SAS storage solutions.

Key Features

  • 1.5Gbps, 3.0Gbps, and 6.0Gbps 18-PHY, Self-Configuring SAS Expander
  • ANSI T10 SAS-2.1/SAS Protocol Layer (SPL) Compliant
  • Automatic Input-Signal Equalization Including Decision Feedback Equalization (DFE)
  • Multiple Programmable Output-Deemphasis Levels
  • Multiple Programmable Output-Voltage Levels
  • Embedded Multicontext MIPS® 4KEc® 32-Bit Microprocessor Used for Local Control and Expander or Vendor-Unique Enclosure Management Functions
  • On-Chip Trace Buffer
  • Internal ECC-Protected User Data SRAM
  • Standard EJTAG Processor Debug Interface
  • Software Compatible with Other Maxim Enclosure Management Processors
  • Two Operating Modes for External Program Memory: Parallel Memory and Serial Peripheral Interface (SPI™) Memory
  • SPI Interface for Accessing an External Serial Flash Memory Device with Optional Dual/Quad I/O SPI Support
  • Auxiliary SPI Port for Access to Peripheral SPI Devices (Manual Access Only)
  • Integrated PHY Snooping on multiple channels
  • Flexible SAS-2-Compliant Address-Based Zoning
  • Supports Table Routing to Destination Addresses
  • Supports SAS-2 Table-to-Table Routing
  • SMP and Dual SSP Virtual PHY Target/Initiator Capability
  • STP/SATA Bridging Supporting Multiple Affiliations (One Per PHY)
  • STP Initiator Capability
  • SAS-2.1/SPL Optical Link Mode
  • SAS-2.1/SPL Power Management
  • LPC Interface for Trusted Platform Modules
  • Unlimited Variable Wide-Port Capability
  • Extensive Diagnostic and Built-In Self-Test (BIST) Capabilities
  • Multimaster I²C Interfaces—I²C High-Speed and 10-Bit Device ID Support
  • Multirate UARTs with Modem Control
  • 10/100 Ethernet Media-Access Controllers (MACs) with Reduced Media-Independent Interface (RMII)
  • Flexible General-Purpose Input/Output (GPIO) for LEDs, Fan Tachometer, and Other Functions
  • SFF-8485 Serial I/O Support
  • Analog-to-Digital Converters (ADCs)
  • Digital Temperature Monitor
  • 75MHz or 150MHz LVTTL/LVPECL Reference Clock
  • 1.0V DC, 1.8V DC, and 3.3V DC External Power Supplies
  • Low Power CMOS
  • 25mm x 25mm, 492-Pin FCBGA Package with Heat Spreader (1.0mm Pin Pitch)
  • RoHS-Compliant Package


  • Enterprise-Storage Environments
  • Fabric-Attached Storage (FAS) Systems
  • Fixed-Content Storage Systems
  • JBOD Arrays
  • Near-Line Storage-Replacement Systems
  • Network-Attached Storage (NAS) Systems
  • Rack-Mounted Servers with RAID
  • Storage-Area Network (SAN) Appliances

Quality and Environmental Data

Request Reliability Report for: MAX72018C 
Lead-Free Package Tin (Sn) Whisker Reports
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

Quality Management System >
Environmental Management System >


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