73S8014BN

Smart Card Interface

Ideal Smart Card Interface IC for STB/Pay-Per-View Conditional Access Applications


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Description

The 73S8014BN is a single smart card (ICC) interface circuit designed to provide full electrical compliance with ISO 7816-3, EMV® 4.2, and NDS specifications. It is derived from the 73S8024RN industry-standard electrical interface, but adds support for 1.8V smart card applications. The 73S8014BN has been optimized to match set-top box/A/V conditional access applications. The optimization adds functionality while creating a device with a smaller pin count. For NDS applications requiring an on-chip adjustable POR, see the Maxim 73S8024RN series of interface ICs.

The 73S8014BN interfaces with the host processor through the same bus (digital I/Os) as the 73S8024RN and most other 8024 type devices. As a result, the 73S8014BN is a very attractive cost-reduction path from traditional 8024 ICs.

Interfacing with the system controller is done through a control bus, composed of digital inputs to control the 73S8014BN, and one interrupt output to inform the system controller of the card presence, device readiness and faults.

The card clock can be generated by an on-chip oscillator using an external crystal or by connection to an externally supplied clock signal. In addition, the clock divider provides divisor values of divide by 1, 2, 4, and 8 that are controlled through a single pin.

The 73S8014BN incorporates an ISO 7816-3 activation/deactivation sequencer that controls the card signals. Level-shifters drive the card signals with the selected card voltage (1.8V, 3V, or 5V), coming from an internal low dropout (LDO) voltage regulator. This LDO regulator is powered by a dedicated power-supply input, VPC. Digital circuitry is powered separately by a digital power supply, VDD. With its embedded LDO regulator, the 73S8014BN is a cost-effective solution for any application where a 5V (typically -5% +10%) power supply is available.

Emergency card deactivation is initiated upon card extraction or upon any fault detected by the protection circuitry. The fault can be a card overcurrent, VCC undervoltage, or power-supply fault (VDD). The card overcurrent circuitry is a true current-detection function, as opposed to VCC voltage drop detection, as usually implemented in non-Maxim 8024 interface ICs.

The 73S8014BN contains a power-down mode with typical power consumption of 1µA on each of the VDD and VPC supplies. The power-down mode is controlled through existing control pins without the need for a dedicated control pin.

73S8014BN: Functional Diagram 73S8014BN: Functional Diagram Enlarge+

Key Features

  • Card Interface
    • Complies with ISO 7816-3, EMV 4.2, and NDS
    • Supports 3V/5V Cards Up to 65mA and 1.8V Cards Up to 40mA
    • ISO 7816-3 Activation/Deactivation Sequencer
    • Automated Deactivation Upon Hardware Fault (i.e., Upon Drop on VDD Power Supply or Card Overcurrent)
    • Overcurrent Detection 145mA max
    • Card CLK Clock Frequency Up to 20MHz
  • System Controller Interface
    • Three Digital Inputs Control the Card Activation/Deactivation, Card Reset, Power-Down, and Card Voltage
    • One Digital Input Controls the Card Clock Frequency
    • One Digital Output, Interrupt to the System Controller, Reports to the Host the Card Presence, Device Readiness, and Faults
    • Crystal Oscillator or Host Clock, Up to 27MHz
  • Regulator Power Supply
    • 4.75V to 5.5V (EMV 4.2)
    • 4.85V to 5.5V (NDS)
  • Digital Interfacing: 2.7V to 3.6V
  • ±6kV ESD Protection on the Card Interface
  • 20-Pin SO Package
  • RoHS-Compliant (6/6)/Lead(Pb)-Free Package

Applications/Uses

  • General-Purpose Smart Card Readers
  • Pay-per-View
  • Set-Top Box Conditional Access Applications

Technical Documents

App Note 4861 Replacing the 73S8024RN with the 73S8014BN

Quality and Environmental Data

Request Reliability Report for: 73S8014BN 
Lead-Free Package Tin (Sn) Whisker Reports
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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