DS1265Y

8M Nonvolatile SRAM


Please check latest availability status for a specific part variant.

Description

The DS1265 8M Nonvolatile SRAMs are 8,388,608-bit, fully static nonvolatile SRAMs organized as 1,048,576 words by 8 bits. Each NV SRAM has a self-contained lithium energy source and control circuitry which constantly monitors VCC for an out-of-tolerance condition. When such a condition occurs the lithium energy source is automatically switched on and write protection is unconditionally enabled to prevent data corruption. There is no limit on the number of write cycles which can be executed and no additional support circuitry is required for microprocessor interfacing.
DS1265AB, DS1265Y: Pin Assignment DS1265AB, DS1265Y: Pin Assignment Enlarge+

Key Features

  • 10 years minimum data retention in the absence of external power
  • Data is automatically protected during power loss
  • Unlimited write cycles
  • Low-power CMOS operation
  • Read and write access times of 70ns
  • Lithium energy source is electrically disconnected to retain freshness until power is applied for the first time
  • Full ±10% VCC operating range (DS1265Y)
  • Optional ±5% VCC operating range (DS1265AB)
  • Optional industrial temperature range of -40°C to +85°C, designated IND
Part NumberMemory TypeMemory SizeBus TypeVSUPPLY
(V)
VSUPPLY
(V)
Package/PinsBudgetary
Price
minmaxSee Notes
DS1265AB NV SRAM1M x 8Parallel4.755.25
MOD/36
$78.01 @1k
DS1265Y 4.55.5
MOD/36
$77.89 @1k
See All Memory (EPROM, EEPROM, ROM, NV SRAM) (52)
Pricing Notes:
This pricing is BUDGETARY, for comparing similar parts. Prices are in U.S. dollars and subject to change. Quantity pricing may vary substantially and international prices may differ due to local duties, taxes, fees, and exchange rates. For volume-specific and version-specific prices and delivery, please see the price and availability page or contact an authorized distributor.

CAD Symbols and Footprints

  • DS1265Y-70+
  • DS1265Y-70IND+
  • Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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