SHA-1 Coprocessor with EEPROM

SHA-1 Coprocessor with EEPROM

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The DS2460 SHA-1 Coprocessor with EEPROM is a hardware implementation of the ISO/IEC 10118-3 Secure Hash Algorithm (SHA-1), eliminating the need to develop software to perform the complex SHA computation required for authenticating SHA devices and for performing the validation of digitally signed service data. The DS2460 communicates with a microcontroller through the popular I²C interface. Applications include hosts of access control and electronic payment systems for token authentication and service data validation as well as generation of one-time-use encryption keys for short message encryption and decryption for messages not exceeding the length of a SHA-1 result, which is 20 bytes.

Key Features

  • Dedicated Hardware-Accelerated SHA Engine for Generating SHA-1 MACs
  • 112 Bytes User EEPROM for Storing End Equipment Property Data
  • I²C Host Interface, Supports 100kHz and 400kHz Communication Speeds
  • Three Address Inputs for I²C Address Assignment
  • Single-Byte to 8-Byte EEPROM Write Sequences
  • 64-Bit Unique Registration Number
  • EEPROM Endurance: 200k Cycles per 8-Byte Block at 25°C
  • 10ms max EEPROM Write Cycle
  • Wide Operating Range: 2.7V to 5.5V, -40°C to +85°C
  • ±4kV IEC 1000-4-2 ESD Protection Level on All Pins
  • 8-Pin SO (150 mils) Package


  • Clone Prevention
  • Door Locks
  • License Management
  • Secure Feature Control
  • System Authentication
  • Utility Meters

Pricing Notes:
This pricing is BUDGETARY, for comparing similar parts. Prices are in U.S. dollars and subject to change. Quantity pricing may vary substantially and international prices may differ due to local duties, taxes, fees, and exchange rates. For volume-specific and version-specific prices and delivery, please see the price and availability page or contact an authorized distributor.

DSAUTHSK: Evaluation Kit for the DS28E01-100, DS28CN01, and DS2460
Product Reliability Reports: DS2460.pdf 
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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