MAX66020

ISO/IEC 14443 Type B-Compliant 1Kb Memory Fob

Unique Identification and Information About a Person or Object


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Description

The MAX66020 combines 1024 bits of user EEPROM, a 64-bit unique identifier (UID), and a 13.56MHz RF interface (ISO/IEC 14443 Type B, Parts 2-4) in a plastic key fob. The memory is organized as 16 blocks of 8 bytes plus two more blocks for data and control registers. Four adjacent user EEPROM blocks form a memory page (pages 0 to 3). Memory protection features are write protection and EPROM emulation, which the user can set for each individual memory page. Memory access is accomplished through the block transmission protocol (ISO/IEC 14443-4), where requests and responses are exchanged through I-blocks once a device is in the ACTIVE state. The data rate can be as high as 847.5kbps. The reader must support a frame size of 19 bytes. The device supports an application family identifier (AFI) and a card identifier (CID). ISO/IEC 14443 functions not supported are chaining, frame-waiting time extension, and power indication.
MAX66020: Typical Operating Circuit MAX66020: Typical Operating Circuit Enlarge+

Key Features

  • Fully Compliant ISO/IEC 14443 (Parts 2-4) Type B Interface
  • 13.56MHz ±7kHz Carrier Frequency
  • 1024-Bit User EEPROM with Block Lock Feature, Write-Cycle Counter, and Optional EPROM-Emulation Mode
  • 64-Bit UID
  • Read and Write (64-Bit Block)
  • Supports AFI and CID Function
  • 10ms Maximum Programming Time
  • To Fob: 10% ASK Modulation at 105.9kbps, 211.9kbps, 423.75kbps, or 847.5kbps
  • From Fob: Load Modulation Using BPSK Modulated Subcarrier at 105.9kbps, 211.9kbps, 423.75kbps, or 847.5kbps
  • 200,000 Write/Erase Cycles (Minimum)
  • 40-Year Data Retention (Minimum)
  • Powered Entirely Through the RF Field
  • Operating Temperature: -25°C to +50°C

Applications/Uses

  • Access Control
  • Asset Tracking
  • Driver Identification (Fleet Application)
Product Reliability Reports: MAX66020.pdf 
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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