Low-Power DOCSIS 3.1 Programmable-Gain Amplifier

Low Power Upstream Programmable Gain Amplifier (PGA) for DOCSIS 3.1

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The MAX3523 is a programmable gain amplifier (PGA) designed to exceed the DOCSIS 3.1 upstream transmit requirements. The PGA meets the DOCSIS 3.1 spurious limits while transmitting a combined output power of 68dBmV over the RF bandwidth of 5MHz to 204MHz. The gain is controlled in 1dB steps over a 60dB range using an SPI 3-wire interface. The use of Maxim's high-voltage CMOS process enables the device to deliver high dynamic range while minimizing power dissipation under a +5V supply rail.

The MAX3523 is available in a 20-pin 5mm x 5mm x 0.75mm TQFN package, and operates over temperature range of 0°C to +70°C.
MAX3523: Simplified Block Diagram MAX3523: Simplified Block Diagram Enlarge+

Key Features

  • Delivers +68dBmV Output Power While Meeting DOCSIS 3.1 Requirements
  • Covers 5MHz–204MHz Output Bandwidth
  • 3.5W Power Consumption with 5V Supply Voltage
  • Programmable Power Codes Allow Operation at Reduced Power Dissipation
  • Exceeds Spurious Requirements with Fully Loaded OFDM Allocation at +65dBmV at Modem Output
  • 20L 5mm x 5mm x 0.75mm TQFN Package with Exposed Paddle
  • Applications/Uses

    • Cable Modem (CM)
    • Customer Premises Equipment (CPE)
    • DOCSIS 3.1 Upstream (D3.1 US)

    See parametric specs for Programmable Gain Amplifiers (5)

    Part NumberInterface TypeRF Freq.
    RF Freq.
    Gain Range
    minmaxminmaxSee Notes
    MAX3523 SPI5204-24 to +384.755.25
    $1.41 @1k

    Pricing Notes:
    This pricing is BUDGETARY, for comparing similar parts. Prices are in U.S. dollars and subject to change. Quantity pricing may vary substantially and international prices may differ due to local duties, taxes, fees, and exchange rates. For volume-specific and version-specific prices and delivery, please see the price and availability page or contact an authorized distributor.

    MAX3523EVKIT: Evaluation Kit for the MAX3523
    Request Reliability Report for: MAX3523 
    Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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