MAX2599

Femto Basestation Bits-to-RF Radio Transmitter

Industry's First Complete Digital Bits to PA Out Transmit Subsystem for WCDMA Band 1 Femto-Basestation Applications


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Description

The MAX2599 complete monolithic direct-conversion I/Q transmitter is designed for WCDMA/HSPA femto basestation transmitter applications. The device is TS25.104 compliant in the 2110MHz to 2170MHz band.

The unique bits-to-RF architecture of the MAX2599 integrates a power amplifier (PA), a quadrature mixer, variable-gain RF and baseband amplifiers, baseband filters, I and Q digital-to-analog converters (DACs), and a fractional-N frequency synthesizer for local oscillator (LO) generation. Data is transferred from the baseband/DSP to the radio by a digital 1-bit sigma-delta modulated I and Q bitstream through an LVDS-like interface. The operating mode of the radio is fully programmable by a 3-wire serial interface.

The MAX2599 is specified for operation in the extended -40°C to +85°C temperature range and is available in a 9mm x 9mm x 1.4mm fcLGA package with exposed paddle (EP).

Key Features

  • Complete Digital Bits-to-RF Output Tx Radio Subsystem
  • 17.5dBm at -52dBc ACLR with 16-Channel Downlink
  • Supports UMTS Bands I and IV Downlink
  • MAX-PHY Digital Tx Interface with Single-Bit I and Q Bitstreams
  • 70dB Integrated Power Control
  • Complete Reference Design Incorporating MAX2547 Receiver Available
  • On-Chip Fractional-N Frequency Synthesizers for LO Generation
  • Operation Controlled Entirely by 3-Wire Serial Interface; No Analog Control Signals Necessary
  • Two General-Purpose Digital Outputs Programmable Through 3-Wire Serial Interface
  • 9mm x 9mm Module Includes Final Stage Matching

Applications/Uses

  • WCDMA/HSPA Femto Basestations: UMTS Band Class I and UMTS Band Class IV

Technical Documents

Tutorial 5499 Spectrum Inversion in NCDMA to Ensure Compliance with 3GPP2
Tutorial 5100 General Layout Guidelines for RF and Mixed-Signal PCBs

Quality and Environmental Data

Product Reliability Reports: MAX2599.pdf 
Lead-Free Package Tin (Sn) Whisker Reports
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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