Product Details
For each of the six EV kits, this document provides a list of equipment required to evaluate each device, a straightforward test procedure to verify functionality, a circuit schematic, a bill of materials (BOM), and artwork for each layer of the PC board.
Key Features
- Each EV Kit is Fully Assembled and Tested
- Fully Monolithic Direct-Conversion Receiver
- Include: PLL Synthesizer (All Except MAX2396/MAX2400) and VCO
- Eliminate: External IF SAW + IF AGC + I/Q Demodulator
- Meet All 3GPP Receiver's Standard Requirements with at Least 3dB Margin on Eb/No
- Operate from a Single +2.7V to +3.3V Supply
- Over 90dB of Gain-Control Range
- Channel Selectivity Fully On-Chip, with Superior ACS (> 40dB)
- SPI™-/QSPI™-/MICROWIRE™-Compatible 3-Wire Serial Interface
- Receiver Current Consumption ≈ 32mA
- On-Chip DC Offset Cancellation
- Small 28-Pin QFN Leadless Package
Applications/Uses
- IMT2000 Handsets
- TD-SCDMA Handsets
- UMTS Handsets
- WCDMA Band II (PCS) Handsets
- WCDMA TDD Handsets
Technical Docs
Data Sheet | Evaluation Kit for the MAX2390, MAX2391, MAX2392, MAX2393, MAX2396, MAX2400 | May 19, 2004 | |
Tutorial | General Layout Guidelines for RF and Mixed-Signal PCBs |
Click any title below to view the detail page where available.
Support & Training
Search our knowledge base for answers to your technical questions.
Filtered SearchOur dedicated team of Applications Engineers are also available to answer your technical questions. Visit our support portal
Parameters
Key Features
- Each EV Kit is Fully Assembled and Tested
- Fully Monolithic Direct-Conversion Receiver
- Include: PLL Synthesizer (All Except MAX2396/MAX2400) and VCO
- Eliminate: External IF SAW + IF AGC + I/Q Demodulator
- Meet All 3GPP Receiver's Standard Requirements with at Least 3dB Margin on Eb/No
- Operate from a Single +2.7V to +3.3V Supply
- Over 90dB of Gain-Control Range
- Channel Selectivity Fully On-Chip, with Superior ACS (> 40dB)
- SPI™-/QSPI™-/MICROWIRE™-Compatible 3-Wire Serial Interface
- Receiver Current Consumption ≈ 32mA
- On-Chip DC Offset Cancellation
- Small 28-Pin QFN Leadless Package
Applications/Uses
- IMT2000 Handsets
- TD-SCDMA Handsets
- UMTS Handsets
- WCDMA Band II (PCS) Handsets
- WCDMA TDD Handsets
Description
For each of the six EV kits, this document provides a list of equipment required to evaluate each device, a straightforward test procedure to verify functionality, a circuit schematic, a bill of materials (BOM), and artwork for each layer of the PC board.
Technical Docs
Data Sheet | Evaluation Kit for the MAX2390, MAX2391, MAX2392, MAX2393, MAX2396, MAX2400 | May 19, 2004 | |
Tutorial | General Layout Guidelines for RF and Mixed-Signal PCBs |
Support & Training
Search our knowledge base for answers to your technical questions.
Filtered SearchOur dedicated team of Applications Engineers are also available to answer your technical questions. Visit our support portal