Complete 450MHz Quadrature Transmitter

Please check latest availability status for a specific part variant.


The MAX2370 integrated quadrature transmitter is designed for 450MHz applications. The device takes a differential I/Q baseband input and converts it up to intermediate frequency (IF) through a quadrature modulator and IF variable-gain amplifier (VGA). The signal is then routed to an external IF filter and upconverted to RF through an image-reject mixer and RF VGA. The signal is further amplified with an on-chip power amplifier (PA) driver. An IF synthesizer, an RF synthesizer, a local oscillator buffer, and an SPI™/QSPI™/MICROWIRE™-compatible, 3-wire programmable bus complete the basic functional blocks of this IC.

The MAX2370 is available in a 48-pin TQFN package with exposed paddle and is specified for the extended temperature range (-40°C to +85°C).
MAX2370: Pin Configuration/Functional Diagram MAX2370: Pin Configuration/Functional Diagram Enlarge+

Key Features

  • 450MHz Operating Frequency
  • +8dBm Output Power
    • -64dBc Typical ACPR at ±885kHz Offset
    • -66dBc Typical ACPR at ±1.125MHz Offset
  • 100dB Power-Control Range
  • Dual Synthesizer for RF and IF Local Oscillators
  • SPI/QSPI/MICROWIRE-Compatible 3-Wire Interface Bus
  • Single-Sideband Upconverter
  • Directly Drives External Power Amplifier


  • 450MHz CDMA/WCDMA Phones
  • OFDM, cdma2000®, WCDMA, NMT
  • Wireless Data Links

See parametric specs for ISM RF Transmitters < 1GHz (15)

Part NumberBand/ Freq.
Tx Output Power
Modulation ModeVSUPPLY
(mm x mm)
MAX2370 45010Quadrature2.7 to 3.37.0 x 7.0

Pricing Notes:
This pricing is BUDGETARY, for comparing similar parts. Prices are in U.S. dollars and subject to change. Quantity pricing may vary substantially and international prices may differ due to local duties, taxes, fees, and exchange rates. For volume-specific and version-specific prices and delivery, please see the price and availability page or contact an authorized distributor.

Technical Documents

Tutorial 5100 General Layout Guidelines for RF and Mixed-Signal PCBs
Request Reliability Report for: MAX2370 
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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