MAX2327

Adjustable, High-Linearity, SiGe, Dual-Band, LNA/Mixer ICs


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Description

The MAX2320, MAX2321, MAX2322, MAX2324, MAX2326, MAX2327, MAX2329 high-performance SiGe receiver front-end ICs set a new industry standard for low noise and high linearity at a low supply current. This family integrates a variety of unique features such as an LO frequency doubler and divider, dual low-noise amplifier (LNA) gain settings, and a low-current paging mode that extends the handset standby time.

The MAX2320 family includes seven ICs: four operate at both cellular and PCS frequencies, one operates at cellular frequencies, one at PCS frequencies, and one is configured as a dual PCS device (see Selector Guide). Each part includes an LNA with a high input third-order intercept point (IIP3) to minimize intermodulation and cross-modulation in the presence of large interfering signals. In low-gain mode, the LNA is bypassed to provide higher cascaded IIP3 at a lower current. For paging, a low-current, high-gain mode is provided.

The CDMA mixers in cellular and PCS bands have high linearity, low noise, and differential IF outputs. The FM mixer is designed for lower current and a single-ended output.

All devices come in a 20-pin TSSOP-EP package with exposed paddle and are specified for the extended temperature range (-40°C to +85°C).
MAX2320, MAX2321, MAX2322, MAX2324, MAX2326, MAX2327: Pin Configuration MAX2320, MAX2321, MAX2322, MAX2324, MAX2326, MAX2327: Pin Configuration Enlarge+

Key Features

  • Ultra-High Linearity at Ultra-Low Current and Noise
  • +2.7V to +3.6V Operation
  • Pin-Selectable Low-Gain Mode Reduces Gain by 15dB and Current by 3mA
  • Pin-Selectable Paging Mode Reduces Current Draw by 6mA when Transmitter is Not in Use
  • LO Output Buffers
  • LO Frequency Doubler (MAX2321)
  • LO Frequency Divider (MAX2326)
  • 0.1µA Shutdown Current
  • 20-Pin TSSOP-EP Package

Applications/Uses

  • CDMA/TDMA/PDC/WCDMA/GSM Cellular Phones
  • Single/Dual/Triple-Mode Phones
  • Wireless Local Loop (WLL)

Technical Documents

Tutorial 5100 General Layout Guidelines for RF and Mixed-Signal PCBs

Quality and Environmental Data

Product Reliability Reports: MAX2327.pdf 
Lead-Free Package Tin (Sn) Whisker Reports
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

Quality Management System >
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