MAX2240

2.5GHz, +20dBm Power Amplifier IC in UCSP Package

Industry's Smallest Bluetooth PA Provides Digital Power Control


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Description

The MAX2240 single-supply, low-voltage power amplifier (PA) IC is designed specifically for applications in the 2.4GHz to 2.5GHz frequency band. The PA is compliant with Bluetooth®, HomeRF, and 802.11 standards, as well as other FSK modulation systems. The PA provides a nominal +20dBm (100mW) output power in the highest power mode.

The PA includes a digital power control circuit to greatly simplify control of the output power. Four digitally controlled output power levels are provided: from +3dBm to +20dBm. A digital input controls the active or shutdown operating modes of the PA. In the shutdown mode, the current reduces to 0.5µA.

The IC integrates the RF input and interstage matching to simplify application of the IC. Temperature and supply-independent biasing are also included to provide stable performance under all operating conditions.

The IC operates from a +2.7V to +5V single-supply voltage. No negative bias voltage is required. Current consumption is a modest 105mA at the highest power level.

The part is packaged in the UCSP™ package significantly reducing the required PC board area. The chip occupies only a 1.56mm x 1.56mm area. The 3 x 3 array of solder bumps are spaced with a 0.5mm bump pitch.
MAX2240: Typical Application Circuit MAX2240: Typical Application Circuit Enlarge+

Key Features

  • 2.4GHz to 2.5GHz Frequency Range
  • High +20dBm Output Power
  • 2-Bit Digital Power Control: Four Output Levels
  • Integrated Input Match to 50Ω
  • Low 105mA Operating Current
  • 0.5µA Low-Power Shutdown Mode Current
  • +2.7V to +5V Single-Supply Operation
  • Miniature Chip-Scale Package (1.56mm x 1.56mm)

Applications/Uses

  • 2.4GHz ISM Proprietary Radios
  • 802.11 FHSS WLAN
  • Bluetooth®
  • HomeRF

CAD Symbols and Footprints

  • MAX2240EBL+
  • MAX2240EBL+T
  • MAX2240EBL+TW
  • MAX2240EBL-T
  • Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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