DS3184

Single/Dual/Triple/Quad ATM/Packet PHYs with Built-In LIU

Industry's First Multiport, T3/E3 ATM/Packet PHYs with Built-In Line Interface Units


Please check latest availability status for a specific part variant.

Description

The DS3181, DS3182, DS3183, and DS3184 (DS318x) integrate ATM cell/HDLC packet processor(s) with a DS3/E3 framer(s) and LIU(s) to map/demap ATM cells or packets into as many as four DS3/E3 physical copper lines with DS3-framed, E3-framed, or clear-channel data streams on per-port basis.
DS3181, DS3182, DS3183, DS3184: Functional Diagram DS3181, DS3182, DS3183, DS3184: Functional Diagram Enlarge+

Key Features

  • Single (DS3181), Dual (DS3182), Triple (DS3183), or Quad (DS3184) with Integrated LIUATM/Packet PHYs for DS3, E3, and Clear-Channel 52Mbps (CC52)
  • Pin Compatible for Ease of Port Density Migration in the Same PC Board Platform
  • Each Port Independently Configurable
  • Perform Receive Clock/Data Recovery and Transmit Waveshaping
  • Jitter Attenuator can be Placed Either in the Receive or Transmit Paths
  • Interfaces to 75Ω Coaxial Cable at Lengths Up 380 Meters or 1246 Feet (DS3) or 440 Meters or 1443 Feet (E3)
  • Uses 1:2 Transformers on Both Tx and Rx
  • Universal PHYs Map ATM Cells and/or HDLC Packets into DS3 or E3 Data Streams
  • UTOPIA L2/L3 or POS-PHY™ L2/L3 or SPI-3 Interface with 8-, 16-, or 32-Bit Bus Width
  • 66MHz UTOPIA L3 and POS-PHY L3 Clock
  • 52MHz UTOPIA L2 and POS-PHY L2 Clock
  • Ports Independently Configurable for Cell or Packet Traffic in POS-PHY Bus Modes
  • Direct, PLCP, DSS, and Clear-Channel Cell Mapping

Applications/Uses

  • Access Concentrators
  • ATM and Frame Relay Equipment
  • Digital Cross Connect
  • Integrated Access Device (IAD)
  • Multiservice Access Platform (MSAP)
  • Multiservice Protocol Platform (MSPP)
  • PBXs
  • PDH Multiplexer/Demultiplexer
  • Routers and Switches
  • SONET/SDH ADM
  • SONET/SDH Muxes
  • Test Equipment

CAD Symbols and Footprints

  • DS3184
  • DS3184+
  • DS3184N
  • DS3184N+
  • Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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