DS3150

3.3V, DS3/E3/STS-1 Line Interface Unit

Industry's First Single-Port T3/E3 LIU with Fully Integrated Jitter Attenuator


Please check latest availability status for a specific part variant.

Description

The DS3150 performs all the functions necessary for interfacing at the physical layer to DS3, E3, and STS-1 lines. The receiver performs clock and data recovery, B3ZS/HDB3 decoding, and loss-of-signal monitoring. The transmitter encodes outgoing data and drives standards-compliant waveforms onto 75Ω coaxial cable. The jitter attenuator can be mapped into the receive path or the transmit path.
DS3150: Functional Diagram DS3150: Functional Diagram Enlarge+

Key Features

  • Integrated Transmitter, Receiver, and Jitter Attenuator for DS3, E3, and STS-1
  • Performs Receive Clock/Data Recovery and Transmit Waveshaping
  • Jitter Attenuator Can Be Placed in the Receive Path or the Transmit Path
  • AGC/Equalizer Block Handles from 0dB to 15dB of Cable Loss
  • Interfaces to 75Ω Coaxial Cable at Lengths Up to 380m (DS3), 440m (E3), or 360m (STS-1)
  • Interfaces Directly to a DSX Monitor Signal (20dB Flat Loss) Using Built-In Preamp
  • Built-In B3ZS and HDB3 Encoder/Decoder
  • Bipolar and NRZ Interfaces
  • Local and Remote Loopbacks
  • On-Board 215 - 1 and 223 - 1 Pseudorandom Bit Sequence (PRBS) Generator and Detector
  • Line Build-Out (LBO) Control
  • Transmit Line-Driver Monitor Checks for a Faulty Transmitter or a Shorted Output
  • Complete DS3 AIS Generator (ANSI T1.107)
  • Unframed All-Ones Generator (E3 AIS)
  • Clock Inversion for Glueless Interfacing
  • Tri-State Line Driver for Low-Power Mode and Protection Switching Applications
  • Loss-of-Signal (LOS) Detector (ANSI T1.231 and ITU G.775)
  • Automatic Data Squelching During LOS
  • Requires Minimal External Components
  • Drop-In Replacement for TDK 78P2241/B and 78P7200L (Refer to Application Note 362)
  • Pin Compatible with TDK 78P7200
  • 3.3V Operation (5V Tolerant I/O), 110mA (max)
  • Industrial Temperature Range: -40°C to +85°C
  • Small Packaging: 28-Pin PLCC and 48-Pin TQFP

Applications/Uses

  • Access Concentrators
  • ATM and Frame Relay Equipment
  • CSUs/DSUs
  • Digital Cross-Connects
  • DSLAMs
  • PBXs
  • Routers
  • SONET/SDH and PDH Multiplexers

CAD Symbols and Footprints

  • DS3150Q
  • DS3150Q+
  • DS3150Q+T&R
  • DS3150QC1+
  • DS3150QN
  • DS3150QN+
  • DS3150QNC1
  • DS3150QNC1+
  • DS3150QNC1+T&R
  • DS3150QNC1/T&R
  • DS3150T
  • DS3150T+
  • DS3150TC1
  • DS3150TC1+
  • DS3150TN
  • DS3150TN+
  • DS3150TN1
  • DS3150TNC1
  • DS3150TNC1+
  • Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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