DS3144

Single/Dual/Triple/Quad DS3/E3 Framers

Industry's Smallest, Lowest Cost DS3/E3 Framers for Up to Four Separate Channels


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Description

The DS3141/DS3142/DS3143/DS3144 devices include all necessary circuitry to frame and format up to four separate DS3 or E3 channels. Each framer in these devices is independently configurable to support M23 DS3, C-Bit Parity DS3, or G.751 E3. The framers interface to a variety of line interface units (LIUs), microprocessor buses, and other system components without glue logic. Each DS3/E3 framer has its own HDLC controller, FEAC controller, and BERT, as well as full support for error detection and generation, performance monitoring, and loopbacks.
DS3141, DS3142, DS3143, DS3144: Functional Diagram DS3141, DS3142, DS3143, DS3144: Functional Diagram Enlarge+

Key Features

  • One/two/three/four independent DS3/E3 framers on a single die
  • Framing and formatting to M23 DS3, C-bit parity DS3, and G.751 E3
  • LIU interface can be binary (NRZ) or dual-rail (POS/NEG)
  • B3ZS/HDB3 encoder and decoder
  • Generate and detect DS3/E3 alarms
  • Integrated HDLC controller for each channel
  • Integrated FEAC controller for each channel
  • Integrated bit error-rate tester (BERT) for each channel
  • Large performance-monitoring counters
  • Line, diagnostic, and payload loopbacks
  • Externally controlled transmit overhead insertion port
  • Support external timing or loop-timing
  • Framers can be powered down when not used
  • 8-bit processor port supports muxed or nonmuxed bus operation (Intel or Motorola)
  • 3.3V supply with 5V tolerant I/O
  • 144-pin 13mm x 13mm CSBGA package
  • IEEE 1149.1 JTAG support
  • Features continued on page 6 of the PDF data sheet

Applications/Uses

  • Access Concentrators
  • ATM and Frame Relay Equipment
  • Digital Cross-Connects
  • PBXs
  • Routers/Switches
  • SONET/SDH and PDH Multiplexers
  • Test Equipment
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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