10Gbps Clock and Data Recovery with Equalizer

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The MAX3992 is a 10Gbps clock and data recovery (CDR) with equalizer IC for XFP optical transmitters. The MAX3992 and the MAX3991 (CDR with limiting amplifier) form a signal conditioner chipset for use in XFP transceiver modules. The chipset is XFI compliant and offers multirate operation for data rates from 9.95Gbps to 11.1Gbps.

The MAX3992 recovers the data for up to 12 inches of FR-4 and one connector without the need for a standalone equalizer. The phase-locked loop is optimized for jitter tolerance in SONET, Ethernet, and Fibre-Channel applications. Low jitter generation of 4mUIRMS leaves adequate margin for meeting SONET jitter requirements at the optical output.

An AC-based power detector asserts the loss-of-signal (LOS) output when the input signal is removed. An external reference clock, with frequency equal to 1/64 or 1/16 of the serial data rate, is used to aid in frequency acquisition. A loss-of-lock (LOL) indicator is provided to indicate the lock status of the receiver PLL.

The MAX3992 is available in a 4mm x 4mm, 24-pin QFN package. It consumes 356mW from a single +3.3V supply and operates over a 0°C to +85°C temperature range.

MAX3992: Typical Application Circuit MAX3992: Typical Application Circuit Enlarge+

Key Features

  • Multirate Operation from 9.95Gbps to 11.1Gbps
  • Span Up to 300mm (12in) FR4 with One Connector
  • Low-Output Jitter Generation: 4mUIRMS
  • Low-Output Deterministic Jitter: 4.6psP-P
  • XFI-Compliant Input Interface
  • LOS Indicator
  • LOL Indicator
  • Power Dissipation: 356mW


  • 10.3Gbps/11.1Gbps Ethernet XFP Transceivers
  • 10.5Gbps Fibre Channel XFP Transceivers
  • 10Gbps DWDM Transceivers
  • 10Gbps XFP Copper Modules
  • 9.95Gbps to 11.1Gbps Optical XFP Modules
  • High-Speed Backplane Interconnects
  • SONET OC-192/SDH STM-64 XFP Transceivers

Technical Documents

App Note 3766 HFTA-12.0: Measuring Crosstalk Penalty in High-Speed Bidirectional Serial Communication Modules

Additional Resources

New Product Press Release 2004-11-23

Tools & Models

  • MAX3992UTG IBIS Model
  • Product Reliability Reports: MAX3992.pdf 
    Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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