Low-Power, Compact 2.5Gbps/2.7Gbps Clock-Recovery and Data-Retiming IC

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The MAX3873 is a compact, low-power 2.488Gbps/ 2.67Gbps clock-recovery and data-retiming IC for SDH/SONET applications. The phase-locked loop (PLL) recovers a synchronous clock signal from the serial NRZ data input. The input data is then retimed by this recovered clock, providing a clean data output. The MAX3873 meets all SDH/SONET jitter specifications, does not require an external reference clock to aid in frequency acquisition, and provides excellent tolerance to both deterministic and sinusoidal jitter. The MAX3873 provides a PLL loss-of-lock (LOL-bar) output to indicate whether the CDR is in lock. The recovered data and clock outputs are CML with on-chip 50Ω back terminations on each line. The clock output can be powered down if not used.

The MAX3873 is implemented in Maxim's second-generation SiGe process and consumes only 260mW at 3.3V supply (output clock disabled, low output swing). The device is available in a 4mm x 4mm 20-pin QFN exposed-pad package and operates from -40¡ÆC to +85¡ÆC.

MAX3873: Typical Application Circuit MAX3873: Typical Application Circuit Enlarge+

Key Features

  • Fully Integrated Clock Recovery and Data Retiming
  • Power Dissipation: 260mW with +3.3V Supply
  • Clock Jitter Generation: 5mUIRMS
  • Exceeds ANSI, ITU, and Bellcore SDH/SONET Jitter Specifications
  • Differential Input Range: 50mVP-P to 1.6VP-P
  • Single +3.3V Power Supply
  • PLL Fast Track (FASTRACK) Mode Available
  • Clock Output Can Be Disabled
  • Input Data Rate: 2.488Gbps or 2.67Gbps
  • Selectable Output Amplitude
  • Tolerates 2000 Consecutive Identical Digits
  • Loss-of-Lock Indicator
  • Differential CML Data and Clock Outputs
  • Operating Temperature Range: -40°C to +85°C
  • Applications/Uses

    • Add/Drop Multiplexers
    • Digital Cross-Connects
    • DWDM Transmission Systems
    • SDH/SONET Receivers and Regenerators
    • SDH/SONET Test Equipment
    • Switch Matrix Backplanes

    Tools & Models

  • MAX3873EGP IBIS Model
  • Product Reliability Reports: MAX3873.pdf 
    Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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