Evaluation Kit for the DS34S132

Please check latest availability status for a specific part variant.


The DS34S132 evaluation kit (EV kit) is an easy-to-use EV kit for evaluating the DS34S132 32-port TDM-over-packet (TDMoP) IC. The EV kit is a stand-alone system with a TDMoP chip, local oscillator, local control processor, memory, external E1/T1 LIUs and framers, power supply, and user interface software included in a 2.5 RU enclosure. The EV kit is controlled over an RS-232 serial link from an external ASCII terminal (typically using terminal emulation software running on a PC) or through a telnet session. The ASCII user interface is menu driven and hierarchical for easy use. The behavior and performance of the TDMoP IC can be evaluated with a single EV kit where the Ethernet signal is looped back to the kit, or with two EV kits configured as separate end points.

Key Features

  • Complete System: Motherboard and Daughter Cards in a Convenient 2.5 RU Enclosure
  • Menu-Driven ASCII Text User Interface Software
  • System Processor on a Separate Daughter Card
  • Ethernet PHYs, I/O Jacks, E1/T1 Transceivers, and Clock Sources on Motherboard
  • Built-In AC Power-Supply Module
  • Several Popular TCXO and OCXO Oscillators from Which to Select and BNC Connectors for Lab References
  • 9-Pin Serial Jack to Connect an ASCII Terminal for Configuration and Status
  • System TCP/IP Stack for Configuration and Status Over IP/Ethernet
  • One RJ45 Ethernet Jack for Connection to the Ethernet Network
  • One RJ45 Jack for Each E1/T1 Port
  • RJ45 External Clock Input Jack
  • BNC Common Clock Input Jack
  • BNC Reference Clock Input Jack
  • 16-Bit CPU Interface to TDMoP IC


  • HDLC-Encapsulated Data Over PSN
  • TDM Circuit Emulation Over PSN (TDM Leased-Line Services Over PSN, TDM Over BPON/GPON/EPON, TDM Over Cable, TDM Over Wireless, Cellular Backhaul, Multiservice Over Unified PSN)
Request Reliability Report for: DS34S132DK 
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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