DS34S104

Single/Dual/Quad/Octal TDM-Over-Packet Transport Devices

Smallest, Most Robust, Lowest Cost Choice for Delivering TDM Services Over Pseudowires


Please check latest availability status for a specific part variant.

Description

These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/G.824, G.8261, and TDM specifications. TDM data is transported in up to 64 individually configurable bundles. All standards-based TDM-over-packet mapping methods are supported except AAL2. Frame-based serial HDLC data flows are also supported. The high level of integration available with the DS34S10x devices minimizes cost, board space, and time to market.

Key Features

  • Transport of E1, T1, E3, T3 or STS-1 TDM or CBR Serial Signals Over Packet Networks
  • Full Support for These Mapping Methods: SAToP, CESoPSN, TDMoIP (AAL1), HDLC, Unstructured, Structured, Structured with CAS
  • Adaptive Clock Recovery, Common Clock, External Clock and Loopback Timing Modes
  • On-Chip TDM Clock Recovery Machines, One Per Port, Independently Configurable
  • Clock Recovery Algorithm Handles Network PDV, Packet Loss, Constant Delay Changes, Frequency Changes and Other Impairments
  • 64 Independent Bundles/Connections
  • Multiprotocol Encapsulation Supports IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, Metro Ethernet
  • VLAN Support According to 802.1p and 802.1Q
  • 10/100 Ethernet MAC Supports MII/RMII/SSMII
  • Selectable 32-Bit, 16-Bit or SPI Processor Bus
  • Operates from Only Two Clock Signals, One for Clock Recovery and One for Packet Processing
  • Glueless SDRAM Buffer Management
  • Low-Power 1.8V Core, 3.3V I/O

Applications/Uses

  • Cellular Backhaul Over PSN
  • HDLC-Based Traffic Transport Over PSN
  • Leased-Line Services Over PSN
  • Multiservice Over Unified PSN
  • TDM Circuit Extension Over PSN
  • TDM Over Cable
  • TDM Over GPON/EPON
  • TDM Over Wireless

CAD Symbols and Footprints

  • DS34S104GN+
  • Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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    Related Resources


    Belle Isle 2020
    05/29/2020 - 05/31/2020, Detroit, MI
    2020 Detroit Grand Prix - Chevrolet Detroit Grand Prix presented by Lear Fast Facts The Chevrolet Detroit Grand Prix presented by Lear was hosted on Belle Isle, May 29 - 30 2020. The event featured the cars of the NTT IndyCar Series, the IMSA WeatherTech SportsCar Championship and the Trans Am Series presented by Pirelli. The weekend is collectively referred to as the Chevrolet Detroit Grand Prix presented by Lear and it once again featured the Chevrolet Dual in Detroit IndyCar doubleheader.

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