DS34S104

Single/Dual/Quad/Octal TDM-Over-Packet Transport Devices

Smallest, Most Robust, Lowest Cost Choice for Delivering TDM Services Over Pseudowires


Please check latest availability status for a specific part variant.

Description

These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/G.824, G.8261, and TDM specifications. TDM data is transported in up to 64 individually configurable bundles. All standards-based TDM-over-packet mapping methods are supported except AAL2. Frame-based serial HDLC data flows are also supported. The high level of integration available with the DS34S10x devices minimizes cost, board space, and time to market.

Key Features

  • Transport of E1, T1, E3, T3 or STS-1 TDM or CBR Serial Signals Over Packet Networks
  • Full Support for These Mapping Methods: SAToP, CESoPSN, TDMoIP (AAL1), HDLC, Unstructured, Structured, Structured with CAS
  • Adaptive Clock Recovery, Common Clock, External Clock and Loopback Timing Modes
  • On-Chip TDM Clock Recovery Machines, One Per Port, Independently Configurable
  • Clock Recovery Algorithm Handles Network PDV, Packet Loss, Constant Delay Changes, Frequency Changes and Other Impairments
  • 64 Independent Bundles/Connections
  • Multiprotocol Encapsulation Supports IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, Metro Ethernet
  • VLAN Support According to 802.1p and 802.1Q
  • 10/100 Ethernet MAC Supports MII/RMII/SSMII
  • Selectable 32-Bit, 16-Bit or SPI Processor Bus
  • Operates from Only Two Clock Signals, One for Clock Recovery and One for Packet Processing
  • Glueless SDRAM Buffer Management
  • Low-Power 1.8V Core, 3.3V I/O

Applications/Uses

  • Cellular Backhaul Over PSN
  • HDLC-Based Traffic Transport Over PSN
  • Leased-Line Services Over PSN
  • Multiservice Over Unified PSN
  • TDM Circuit Extension Over PSN
  • TDM Over Cable
  • TDM Over GPON/EPON
  • TDM Over Wireless

CAD Symbols and Footprints

  • DS34S104GN
  • DS34S104GN+
  • Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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